Copper-Silver Alloy Sheet Hardness via Annealing
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Solution Overview
Problem
Existing methods for manufacturing sheet materials made of copper-silver alloy fail to achieve satisfactory hardness levels required for electrode sheets in probe cards for semiconductor inspection.
Innovation Solution
A method involving continuous casting of copper-silver alloy to form a base material, followed by rolling to achieve a thickness of 0.01 to 0.10 mm, and subsequent annealing to achieve a Vickers hardness of 280 HV or higher.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional manufacturing methods are used for copper-silver alloy sheet material, then the material can be produced with basic properties, but the hardness is insufficient for probe card electrode applications
Solution Approach 1:
The patent applies parameter changes by precisely controlling the silver content (2-30 mass%), casting temperature (1000-1400°C), and rolling reduction rate (20-80%) to achieve the target Vickers hardness of 280 HV or higher while maintaining electrical conductivity. This systematic parameter optimization resolves the contradiction between achieving high hardness and maintaining ease of manufacture.
Solution Approach 2:
The patent utilizes composite material principles by creating a copper-silver alloy with specific phase distribution and grain structure through controlled solidification and rolling. The dual-phase microstructure (α-phase and β-phase) provides both the required hardness and electrical conductivity, resolving the contradiction between strength and manufacturability.
2Length of moving object
If the sheet material is made thinner to meet probe card electrode specifications, then it becomes more suitable for application, but achieving high hardness becomes more difficult
Solution Approach 1:
The patent applies preliminary action by performing controlled rolling with specific reduction rates (20-80%) at intermediate stages to establish the desired microstructure and grain refinement before final thinning. This preliminary microstructure control ensures that even at thicknesses of 0.01-0.10 mm, the material achieves Vickers hardness of 280 HV or higher.
Solution Approach 2:
The patent transitions from controlling only thickness to controlling the microstructural dimension (grain size, phase distribution) simultaneously. By managing the microstructure through controlled rolling and heat treatment, the patent achieves high hardness in ultra-thin sheets (0.01-0.10 mm) that would otherwise be difficult to produce.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively produces sheet materials with enhanced hardness, suitable for use in probe card electrodes, while maintaining adequate electrical conductivity.
Implementation Method 1
casting continuously copper-silver alloy so as to obtain base material
Implementation Method 2
annealing the sheet material, wherein the sheet material having undergone operation in the step (c) has a Vickers hardness of 280 HV or higher
Data Source
AI summary
A method of manufacturing sheet material made of copper-silver alloy, the method comprising the steps of: (a) casting continuously copper-silver alloy so as to obtain base material having a thickness or diameter within a range of 6 to 30 mm; (b) rolling the base material at least once so as to obtain sheet material having a thickness within a range of 0.01 to 0.10 mm; and (c) annealing the sheet material, wherein the sheet material having undergone operation in the step (c) has a Vickers hardness of 280 HV or higher.