Copper Substrate Circuit Packaging with Hermetic Seals
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Solution Overview
Problem
Current surface mount packages for discrete circuit components face challenges such as high costs, poor heat dissipation, and regulatory compliance issues due to insufficient thermal conductivity, leading to increased manufacturing complexity and reduced production yield.
Innovation Solution
A method involving copper substrates with protruding pads and conductive pastes is used to form secure electrical connections and hermetic seals, enhancing thermal and electrical conductivity while simplifying the fabrication process and improving automation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional glass tube/plastic packages or lead-frame-based packages are used, then manufacturing is simpler and costs are lower, but thermal conductivity is insufficient leading to poor heat dissipation
Solution Approach 1:
The patent changes the material parameter of the substrate from traditional plastic or glass to copper, which fundamentally alters the thermal conductivity parameter. This material substitution enables superior heat dissipation performance while maintaining manufacturing feasibility through adapted fabrication processes.
Solution Approach 2:
The patent employs composite material structures including copper substrates combined with ceramic insulators and metal encapsulants. This composite approach achieves both high thermal conductivity through copper pathways and manageable manufacturing complexity by combining materials with complementary properties.
2Temperature
If copper substrates are used to improve thermal conductivity, then heat dissipation performance improves, but manufacturing complexity and costs increase
Solution Approach 1:
The patent segments the device into distinct functional modules: copper substrate for thermal management, ceramic insulator for electrical isolation, and metal encapsulant for protection. This segmentation allows each component to be optimized independently and assembled through standardized processes, reducing overall fabrication complexity.
Solution Approach 2:
The copper substrate serves multiple functions simultaneously: it acts as the mechanical base, the thermal conduction pathway, and the electrical connection carrier. This multi-functionality reduces the number of separate components needed, thereby simplifying the overall device structure and fabrication process.
3Reliability
If copper substrates with protruding pads and hermetic seals are used, then electrical connection reliability and heat dissipation improve, but manufacturing costs and process complexity increase
Solution Approach 1:
The patent incorporates protruding pads on the copper substrate that are pre-formed during substrate fabrication. These pads are prepared in advance to receive and bond with the semiconductor die, ensuring reliable electrical connections are established before final assembly. This preliminary preparation reduces the complexity of subsequent bonding operations.
Solution Approach 2:
The patent employs a nested structure where the semiconductor die is bonded to the copper substrate, which is then enclosed within a metal encapsulant that forms a hermetic seal. This nested arrangement protects the electrical connections while maintaining a compact structure that is relatively simple to manufacture.
4Ease of manufacture
If traditional packaging materials are used, then manufacturing costs are lower, but compliance with environmental regulations becomes difficult
Solution Approach 1:
The patent changes the material composition parameters by substituting traditional lead-containing solders and plastics with lead-free alternatives and environmentally friendly materials. This parameter change enables compliance with RoHS and other environmental regulations while maintaining manufacturing feasibility through updated processing parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved heat dissipation, mechanical properties, and extended component life, reducing manufacturing costs and enhancing compliance with environmental regulations.
Implementation Method 1
forming a first electrode of the dice facing the second protruding pad; stacking the first copper substrate onto the second copper substrate with the first protruding pad having a conductive paste coated thereon aligned and pressing onto the circuit dice
Implementation Method 2
further forming a hermetic seal in the space between the first and second copper substrates
Implementation Method 3
copper substrates with protruding pads and conductive pastes is used to form secure electrical connections and hermetic seals, enhancing thermal and electrical conductivity
Data Source
AI summary
A method for packaging a circuit component, comprising: forming a first protruding pad on a first copper substrate and a through-hole in the first protruding pad; forming a second protruding pad on a second copper substrate and placing a circuit dice of the circuit component on the second protruding pad having a conductive paste coated thereon wherein a first electrode of the dice facing the second protruding pad; stacking the first copper substrate onto the second copper substrate with the first protruding pad having a conductive paste coated thereon aligned and pressing onto the circuit dice placed on the second protruding pad wherein a second electrode of the dice facing the first protruding pad; inserting a copper rod tightly into the through-hole until contacting with a conductive paste coated on the second substrate; heat-treating the stacked structure for the circuit dice and the copper rod to form secured electrical connection with the first and second copper substrates respectively and further forming a hermetic seal in the space between the first and second copper substrates; and using the hermetic seal as a rigid processing structure, etching the exposed surface of the first and second copper substrates to remove the entire thickness of copper other than in the area of the first and second protruding pads and in the area other than where the copper rod connects to the second copper substrate, thereby forming the device terminals of the circuit component package.