Copper (II) Sulphide Eggshell Sorbent for Heavy Metal Capture
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Solution Overview
Problem
Existing sorbents for capturing heavy metals like mercury and arsenic from fluid streams face inefficiencies due to high copper content, which can lead to increased costs and undesirable sulphiding processes, and require improvements in copper utilization and contaminant metal control.
Innovation Solution
A sorbent composition with a low copper content (0.5-20% by weight) and a copper (II) sulphide eggshell layer on a shaped support material, such as alumina, optimized for efficient heavy metal capture, using a copper carbonate slurry or copper ammine compound application followed by sulphiding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high copper content sorbent is used, then heavy metal capture capacity is improved, but cost increases and sulphiding process becomes more difficult
Solution Approach 1:
The sorbent is pre-sulphided during manufacturing to form copper (II) sulphide on the surface before use. This preliminary sulphiding action eliminates the need for difficult high-temperature sulphiding operations during plant operation and ensures the sorbent is ready for immediate effective use in capturing heavy metals from fluid streams
Solution Approach 2:
The invention changes the copper content parameter to a low range (0.5-20% by weight) and controls contaminant metal sulphide content to ≤5% by weight. These parameter changes enable effective heavy metal capture while avoiding the need for aggressive sulphiding conditions and reducing manufacturing complexity
2Reliability
If high copper content is used in granulated sorbent, then mercury capture effectiveness is improved, but copper cost increases
Solution Approach 1:
The copper (II) sulphide is concentrated on the surface of the support material in an eggshell configuration, creating a local region of high sorptive activity where it is needed most. This local quality approach ensures effective mercury capture at the interface with the fluid stream while using minimal bulk copper content (0.5-20% by weight)
Solution Approach 2:
The sorbent is constructed as a composite material combining a support structure (such as alumina spheres or shaped particulate units) with a copper (II) sulphide coating layer. This composite structure provides both mechanical integrity and sorptive function, achieving effective mercury capture with low overall copper content while maintaining sorbent stability
3Stability of the object's composition
If copper is made unavailable within extrudate, then sorbent stability is improved, but copper utilization decreases
Solution Approach 1:
The copper is extracted from the bulk interior of the sorbent and placed specifically on the surface as a copper (II) sulphide layer. This extraction eliminates the problem of copper being trapped and unavailable in the center of granules or extrudates, ensuring 100% copper utilization at the surface while maintaining sorbent structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sorbent achieves effective mercury and arsenic removal with reduced copper usage, maintaining high capacity and stability, even in the presence of free water, and allows for efficient regeneration.
Implementation Method 1
The copper compound in the granules, extrudates or support is sulphided using hydrogen sulphide or a solution of a sulphide in water or in an organic solvent
Implementation Method 2
The sorbent is prepared by mixing a copper compound such as powdered copper hydroxycarbonate (also known as basic copper carbonate) with a support or dispersion material, for example a cement, and forming extrudates or granules
Data Source
AI summary
A sorbent composition is described comprising a layer of a copper compound selected from copper (II) sulphide, copper hydroxycarbonate or copper oxide on the surface of a support material, wherein the thickness of the copper compound layer on the support material is in the range 1-200µm.