Copper Terminal Surface Film for Resin Adhesion in Semiconductor Packages
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Solution Overview
Problem
The adhesion between terminals made of copper and molding resin in semiconductor devices is poor, leading to potential peeling of the resin, which can result in corrosion and degradation of the device's reliability.
Innovation Solution
A functional film comprising a copper oxide film and an organic film is applied to the copper surface, bonded via covalent bonds, and the resin is bonded to the organic film, enhancing adhesion and preventing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper is used as terminal material, then electrical conductivity is improved, but adhesion to molding resin deteriorates
Solution Approach 1:
A functional film comprising an organic film containing oxygen atoms is introduced as an intermediary layer between the copper terminal and the molding resin. This functional film serves as a mediator that provides both electrical conductivity (through the copper-oxide layer) and adhesion to the resin (through the organic layer), thereby resolving the contradiction between conductivity and adhesion.
Solution Approach 2:
The terminal structure employs a composite material system consisting of copper, copper oxide, and organic film layers. This composite structure combines the high electrical conductivity of copper with the adhesion properties of the organic film, allowing simultaneous achievement of both conductivity and bonding strength to the molding resin.
2Object-affected harmful factors
If molding resin is applied to seal terminal, then protection from outside air is improved, but peeling occurs due to poor adhesion
Solution Approach 1:
The functional film acts as an intermediary bonding layer that enables strong adhesion between the molding resin and the copper terminal. The organic portion of the functional film chemically bonds to the resin while the copper-oxide portion bonds to the copper, preventing peeling and ensuring the sealing function is maintained.
Solution Approach 2:
The invention changes the surface properties of the copper terminal by forming a functional film with specific chemical composition (containing oxygen atoms and organic components). This parameter change in surface chemistry enables the molding resin to form strong bonds with the terminal surface, preventing peeling while maintaining the protective sealing function.
3Strength
If functional film is formed on copper surface, then adhesion to resin is improved, but manufacturing complexity increases
Solution Approach 1:
The functional film is formed on the copper terminal surface before the molding resin is applied. This preliminary action ensures that the adhesion-promoting surface is already in place before sealing, simplifying the overall manufacturing process by eliminating the need for separate adhesion treatment steps after molding.
Solution Approach 2:
The copper terminal surface spontaneously forms copper oxide when exposed to oxygen, and the organic film can be formed through chemical treatment. These self-organizing processes reduce the need for complex external intervention, allowing the functional film to form with minimal manufacturing complexity while still achieving the required adhesion properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the bonding force between the terminal and the resin, preventing peeling and corrosion, thereby improving the reliability of the semiconductor device.
Implementation Method 1
bonded via covalent bonds
Data Source
AI summary
According to one embodiment, a semiconductor device has a semiconductor chip. It has a terminal which is connected to the semiconductor chip and which comprises a first surface region containing copper. It has a functional film formed on at least a portion of a surface of the first surface region. It has a resin which covers a portion of the terminal and the semiconductor chip. The functional film comprises an organic film containing oxygen atoms. The organic film is bonded to the resin.