Copper Thin Layer Substrate via Separation-Inducing Layer
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Solution Overview
Problem
The existing methods for producing printed circuit boards face challenges in forming fine circuit patterns due to limitations in controlling interconnection spacing, and the use of thin copper foils is costly and difficult to produce, with diffusion issues between copper and carrier materials complicating the manufacturing process.
Innovation Solution
A method involving a carrier with a separation-inducing layer, such as a porous aluminum layer and a sealing layer, is used to prevent diffusion and facilitate easy separation, allowing for the formation of a thin copper layer suitable for fine pattern formation through electroless plating and semi-additive processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a thin copper foil is used for fine pattern formation, then the manufacturing precision is improved, but the production cost increases and the availability of the material decreases
Solution Approach 1:
The copper foil production process is segmented into two distinct stages: first, a thick copper foil is produced using conventional methods; second, a thin copper layer is formed on the thick foil through electroless plating. This segmentation allows the use of easily manufacturable thick copper foil as a base, while achieving the desired thin layer precision through the plating process, thereby resolving the contradiction between manufacturing ease and precision.
Solution Approach 2:
A thick copper foil is prepared in advance as a base layer before the thin copper layer is formed through electroless plating. This preliminary action provides a stable, easily manufacturable foundation that enables subsequent precise thin layer formation, eliminating the need to produce thin copper foil directly and thus resolving the production difficulty and cost issues.
2Ease of manufacture
If thick copper foil is used instead of thin copper foil, then the production cost decreases and availability improves, but the manufacturing precision for fine patterns deteriorates
Solution Approach 1:
The copper layer is segmented into a thick base foil layer (easily manufactured) and a thin plated layer (precise). The thick foil provides manufacturing ease and availability, while the thin plated layer achieves the required precision for fine patterns through controlled electroless plating, thus resolving the contradiction between ease of manufacture and precision.
Solution Approach 2:
The copper layer thickness parameter is changed in two stages: first to a thick value for easy manufacturing, then to a thin value through electroless plating. This parameter change allows the process to benefit from both thick foil availability and thin layer precision, resolving the contradiction between production ease and manufacturing precision.
3Manufacturing precision
If additional etching is performed to reduce copper foil thickness, then the copper foil thickness is reduced to desired levels, but the production cost increases and environmental pollution increases
Solution Approach 1:
The mechanical/chemical etching process is replaced with an electroless plating process to reduce copper thickness. Instead of removing copper through etching (which causes pollution), a thin copper layer is deposited through electroless plating, achieving precise thickness control without environmental harm, thus resolving the contradiction between thickness control and environmental pollution.
Solution Approach 2:
The harmful etching process is converted into a beneficial electroless plating process. Rather than removing copper through polluting etching, a thin copper layer is added through electroless plating, achieving the desired thickness control while eliminating environmental pollution, thus transforming a harmful process into a beneficial one.
4Strength
If diffusion occurs between carrier aluminum and copper, then the bonding strength is improved, but the ease of separation deteriorates
Solution Approach 1:
A separation-inducing layer is introduced as an intermediary between the carrier aluminum and copper layers. This intermediate layer prevents direct diffusion and bonding between aluminum and copper, maintaining sufficient bonding strength for structural integrity while enabling easy separation when needed, thus resolving the contradiction between bonding strength and separation ease.
Solution Approach 2:
The interface between carrier and copper is segmented by introducing a separation-inducing layer. This segmentation prevents direct diffusion bonding while maintaining overall structural integrity, allowing easy separation when required, thus resolving the contradiction between bonding strength and separation ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of substrates with consistent thickness and surface roughness, reducing production costs and environmental impact while enabling the creation of fine circuit patterns, as the separation-inducing layer prevents interdiffusion and allows for chemical etching of the carrier, simplifying the manufacturing process.
Implementation Method 1
forming a separation-inducing layer on the surface of the carrier... preventing diffusion at the interface between a carrier and the copper thin layer
Implementation Method 2
allows for chemical etching of the carrier, simplifying the manufacturing process
Implementation Method 3
formation of a thin copper layer suitable for fine pattern formation through electroless plating
Data Source
AI summary
One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.