Copper-Metallized Through Holes Without Radial Cracking
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Solution Overview
Problem
Glass and glass ceramic substrates with copper-metallized through holes are prone to radial cracking during heating due to thermal expansion mismatch between copper and the substrate, leading to reduced efficiency or unusability.
Innovation Solution
Control the heating process by maintaining an average heating rate between 0.0°C/min and 8.7°C/min, specifically between 200°C and 450°C, with optional temperature holds to minimize stress and prevent radial cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If copper is used to fill through holes in glass or glass ceramic substrates, then electrical conductivity is improved, but radial cracking occurs during heating
Solution Approach 1:
The patent applies parameter changes by controlling the heating rate (maintaining it below 8.7°C/min) and managing temperature transitions during the heating process. This controlled parameter change allows the copper-metallized through hole structure to accommodate thermal expansion differences without developing radial cracks, thus maintaining both electrical conductivity and structural integrity
Solution Approach 2:
The patent employs dynamics by implementing a controlled, gradual heating process rather than instantaneous heating. The dynamic control of heating rate allows the system to adapt to thermal stresses progressively, preventing crack formation while maintaining the copper's electrical conductivity function
2Productivity
If heating rate is increased to improve productivity, then manufacturing time is reduced, but radial cracking increases
Solution Approach 1:
The patent establishes a specific parameter range for heating rate (0.01 to 8.7°C/min) that optimizes the balance between manufacturing efficiency and product quality. This parameter control ensures that productivity is maintained at acceptable levels while preventing radial cracking through controlled thermal transitions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed heating process effectively reduces or eliminates radial cracking in glass and glass ceramic articles with copper-metallized through holes, ensuring their structural integrity and functionality.
Implementation Method 1
radial cracking during heating due to thermal expansion mismatch between copper and the substrate
Data Source
AI summary
A process for heating a glass or glass ceramic article with copper-metallized through holes includes heating the article from a first temperature to a second temperature. The first temperature is greater than or equal to 200° C. and less than or equal to 300° C., and the second temperature is greater than or equal to 350° C. and less than or equal to 450° C. An average heating rate during the heating of the article from the first temperature to the second temperature is greater than 0.0° C./min and less than 8.7° C./min. An article includes a glass or glass ceramic substrate having at least one through hole penetrating the substrate in a thickness direction; and copper present in the at least one through hole. The article does not comprise radial cracks.