Copper-Titanium Etching via Maleic Acid Composition
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Solution Overview
Problem
Existing etching methods for copper- and titanium-containing multilayer films face issues such as gas and heat generation, unstable etching performance, and difficulty in achieving good wiring configuration, particularly when using etchants containing hydrogen peroxide or peroxosulfuric acid, and peroxide-free etchants struggle to etch both copper and titanium effectively.
Innovation Solution
A liquid composition comprising a maleic acid ion source, a copper ion source, and a fluoride ion source, with a pH value of 0-7, is used to etch copper- and titanium-containing multilayer films, providing a stable and safe etching process that effectively removes both copper and titanium layers without gas or heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If etchants containing hydrogen peroxide or peroxosulfuric acid are used, then copper etching capability is improved, but gas and heat generation occurs due to decomposition, and etching performance becomes unstable
Solution Approach 1:
The patent changes the chemical composition parameters of the etchant by replacing hydrogen peroxide/peroxosulfuric acid with a specific combination of maleic acid, copper ion source, and fluoride ion source. This parameter change eliminates decomposition reactions while maintaining effective etching of copper and titanium multilayer films, thereby removing gas and heat generation while stabilizing etching performance
Solution Approach 2:
The patent converts the harmful decomposition behavior of peroxide-based etchants into a beneficial stable etching process. By using maleic acid and fluoride ion source combination, the etchant achieves effective copper and titanium etching without the harmful decomposition side reactions, transforming a harmful process into a clean and stable one
2Object-generated harmful factors
If peroxide-free copper etchants are used, then gas and heat generation is reduced, but difficulty in etching titanium effectively
Solution Approach 1:
The patent creates a universal etchant formulation that can effectively etch both copper and titanium simultaneously. The combination of maleic acid, copper ion source, and fluoride ion source provides multi-functionality by addressing the etching requirements of both metals, eliminating the need to choose between copper-specific or titanium-specific etchants
Solution Approach 2:
The patent introduces fluoride ion source as an intermediary component that enables effective titanium etching in the peroxide-free system. The fluoride ions act as a mediator that facilitates titanium dissolution while the maleic acid and copper ion source handle copper etching, allowing simultaneous effective etching of both metals without peroxide
3Reliability
If existing etchants are used, then copper etching is achieved, but wiring configuration is poor after etching
Solution Approach 1:
The patent optimizes the chemical parameters of the etchant by using a specific combination of maleic acid, copper ion source, and fluoride ion source with controlled pH (0-7). This parameter optimization improves the anisotropy and uniformity of etching, resulting in superior wiring configuration with better line width control and reduced side etching compared to existing etchants
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a good etching rate of 0.1-10 μm/min, ensuring stable and safe etching with minimal change in etching rate over time, suitable for upsizing and resolution enhancement in display devices, and prevents odor generation, making it environmentally harmless and easy to handle.
Implementation Method 1
a liquid composition used for etching a copper- and titanium-containing multilayer film... comprising a maleic acid ion source, a copper ion source and a fluoride ion source
Data Source
AI summary
The present invention provides a liquid composition used for etching a copper- and titanium-containing multilayer film, a method for etching a copper- and titanium-containing multilayer film by using said liquid composition, a method for manufacturing multilayer-film wiring according to said etching method, and a substrate provided with multilayer-film wiring manufactured according to said manufacturing method. According to the present invention, a liquid composition comprising (A) a maleic acid ion source, (B) a copper ion source and (C) a fluoride ion source and having the pH value of 0-7 is used.