Copper Tube Interconnect for Semiconductor Die
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Solution Overview
Problem
Conventional electrical conductor-based connections in semiconductor devices face power and bandwidth limitations, and optical interconnects pose challenges due to alignment requirements and complexity, making it difficult to achieve high-density, low-power interconnects between semiconductor die without increasing power consumption or die size.
Innovation Solution
The fabrication of combined electrical and optical copper tube interconnect structures, where copper tubes are formed over optical components and filled with optically transparent media, allowing for both electrical and optical signal transmission, and aligned for attachment between die or a package substrate using techniques like solder reflow or thermal compression bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional electrical conductor-based connections (wires or TSVs) are used for interconnect, then electrical signal transmission is achieved, but power consumption increases and bandwidth is limited
Solution Approach 1:
The interconnect function is segmented into separate electrical and optical pathways. Electrical conductors (copper tubes) handle power and electrical signals, while optical waveguides handle data communication, allowing each to be optimized independently for their respective functions
Solution Approach 2:
The patent combines electrical and optical interconnect functions into a single integrated structure where copper tubes for electrical connection and optical waveguides for optical signal transmission are merged, enabling simultaneous electrical and optical signal transmission through the same physical pathway
2Productivity
If optical interconnects are used to replace electrical interconnects, then bandwidth increases and power consumption decreases, but alignment tolerances become extremely tight and system complexity increases
Solution Approach 1:
The patent combines electrical and optical interconnect functions into a single integrated structure where copper tubes for electrical connection and optical waveguides for optical signal transmission are merged, enabling simultaneous electrical and optical signal transmission through the same physical pathway
Solution Approach 2:
The copper tube serves as an intermediary structure that provides both electrical conductivity and mechanical alignment support for the optical waveguide, facilitating precise alignment between stacked die while maintaining electrical connection
3Productivity
If massive parallel interconnect systems with separate electrical and optical interconnects are used, then interconnect capacity increases, but die area and power requirements increase significantly
Solution Approach 1:
The patent combines electrical and optical interconnect functions into a single integrated structure where copper tubes for electrical connection and optical waveguides for optical signal transmission are merged, enabling simultaneous electrical and optical signal transmission through the same physical pathway
Solution Approach 2:
The copper tube structure serves multiple functions simultaneously: it provides electrical conductivity for power and signal transmission, acts as a mechanical support structure for alignment, and enables both electrical and optical interconnect capabilities through a single unified pathway
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient, high-density data and power transfer between semiconductor die or a package substrate with reduced power consumption by utilizing the copper tubes for electrical connections and optically transparent media for optical signals, addressing the limitations of conventional interconnects.
Implementation Method 1
copper tubes for electrical connections
Implementation Method 2
optically transparent media for optical signals
Data Source
AI summary
A method and apparatus are provided for fabricating an electro-optical interconnect on an integrated circuit (101, 114) in which an optical circuit element (102) is formed by forming a cylinder-shaped conductive interconnect structure (120, 122, 126, 128) with one or more conductive layers formed around a central opening (129) which is located over an optically transparent layer (118) located over the optical circuit element (102).