Core Cavity Plated Support for Embedded Passive Components
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Solution Overview
Problem
The integration of passive components like capacitors and inductors into the core of a package substrate is hindered by thickness mismatches, leading to shifting and rotation during embedding, which complicates electrical contact and manufacturing.
Innovation Solution
A plated layer is formed at the bottom of the cavity within the core using a tenting lithography process, supporting the passive component to maintain its position and reduce thickness mismatches, facilitating easier embedding and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components are embedded in deep cavities through the core, then space utilization is improved, but the components may shift or rotate during embedding
Solution Approach 1:
The patent applies a tenting lithography process to form a plated layer at the bottom of the cavity before embedding the passive component. This preliminary action creates a stable foundation that prevents shifting and rotation during the embedding process, while still allowing deep cavity embedding for space utilization
Solution Approach 2:
The plated layer formed by the tenting lithography process acts as an intermediary between the cavity bottom and the passive component. This intermediate structure provides mechanical support and stabilization, enabling the component to remain fixed in position while embedded in the deep cavity
2Strength
If the core thickness is increased to meet thermomechanical stress requirements, then structural integrity is improved, but the thickness mismatch with passive components worsens
Solution Approach 1:
The tenting lithography process creates a localized plated layer at the bottom of the cavity with a specific thickness profile. This local quality adjustment allows the core to maintain its required thickness for structural integrity while providing a precisely matched interface for the passive component at the cavity location
Solution Approach 2:
The patent changes the local thickness parameter of the plated layer formed by tenting lithography to match the passive component thickness. This parameter adjustment resolves the thickness mismatch issue while allowing the overall core thickness to remain sufficient for thermomechanical stress requirements
3Device complexity
If passive components are placed in deep cavities, then routing complexity is reduced, but electrical contact difficulty increases
Solution Approach 1:
The tenting lithography process preliminarily forms a plated layer that extends up the sidewalls of the cavity. This preliminary structure creates built-in contact points that simplify subsequent electrical connection processes, making it easier to establish electrical contact with components embedded in deep cavities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution stabilizes the passive components, reduces displacement, and enables shorter vias, improving manufacturing efficiency and electrical connectivity.
Implementation Method 1
A plated layer is formed at the bottom of the cavity within the core using a tenting lithography process
Data Source
AI summary
Embodiments disclosed herein include components that are embedded within a core of a package substrate. In an embodiment, the component is supported on a pad provided at a bottom of a cavity through the core. In an embodiment, such an apparatus may comprise a substrate with a cavity through a thickness of the substrate. In an embodiment, the cavity comprises sidewalls. In an embodiment, a layer spans an opening of the cavity, and the layer covers at least a portion of the sidewalls of the cavity. In an embodiment, a component is coupled to the layer, and the component is at least partially within the cavity.