Core Cavity Substrate for Embedding Low-Height IC Devices
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Solution Overview
Problem
Integrated circuit (IC) packages face challenges in mitigating warpage and efficiently embedding electrical devices due to incompatible core thickness and device height, leading to fabrication issues and reduced stability.
Innovation Solution
A substrate design with a core layer featuring a cavity that embeds reduced height electrical devices, allowing for the integration of multiple devices and maintaining mechanical stability by using a back-to-front or back-to-back configuration of electrical devices or a spacer structure, ensuring compatibility with existing fabrication techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the core thickness is increased to provide mechanical stability and mitigate warpage, then the mechanical stability is improved, but the cavity height becomes insufficient to accommodate standard electrical devices
Solution Approach 1:
The patent applies nesting by placing one electrical device inside another electrical device within the cavity. The first electrical device is positioned such that it is at least partially inside the second electrical device, allowing both devices to coexist in a limited vertical space. This nested configuration enables the substrate to accommodate standard-height electrical devices while maintaining a relatively thin core thickness for mechanical stability.
2Volume of moving object
If the core thickness is decreased to accommodate shorter electrical devices, then the device embedding is improved, but the mechanical stability and warpage mitigation are reduced
Solution Approach 1:
By nesting electrical devices within each other, the patent maximizes the utilization of vertical space within the cavity. This allows the core to maintain adequate thickness for mechanical support while still providing sufficient cavity height through efficient spatial arrangement of embedded devices.
3Ease of manufacture
If standard fabrication techniques are used for embedding electrical devices, then the manufacturing process is simplified, but devices with incompatible height dimensions cannot be properly embedded
Solution Approach 1:
The patent segments the electrical devices into a hierarchical arrangement where one device is positioned inside another. This segmentation allows each device to be fabricated using standard techniques with planar surface requirements, while the nested arrangement accommodates devices with varying height dimensions. The fabrication process can proceed with conventional techniques without requiring specialized equipment or processes.
Data Source
AI summary
Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods are also disclosed. The cavity of the core (that has one or more core layers) of the substrate includes an embedded electrical device structure that an electrical device built upon another second component(s) to make the overall height of the electrical device structure compatible with the height of the cavity of the core. In this manner, the design criteria used to select thickness or height of the core for providing the desired stability in the substrate can be incompatible with the thickness or the height of the embedded electrical device.