Core Duct and Bleed Duct Layout for VLC Cooling Isolation
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Solution Overview
Problem
Cooling vertically-oriented integrated circuits and optical devices in VLC systems is challenging due to airflow management and heat dissipation inefficiencies.
Innovation Solution
A VLC system with a vertically-oriented PCB, IC heat sink, and IC ducts that isolate airflow paths above and below the IC, allowing independent control of airflow rates for precise cooling, using a vapor chamber and fin stacks to dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single airflow path is used for cooling vertically-oriented ICs and optical devices, then the system structure is simple, but the cooling efficiency is insufficient and heat dissipation is ineffective
Solution Approach 1:
The patent divides the single airflow path into multiple separate airflow paths: a first airflow path for cooling the IC and a second airflow path for cooling optical devices. This segmentation allows each component to receive dedicated cooling airflow, improving cooling efficiency while maintaining manageable system complexity through modular duct design.
2Ease of operation
If airflow paths are isolated for independent cooling control, then cooling precision is improved, but device complexity increases
Solution Approach 1:
The airflow system is segmented into independent paths with separate fan control, enabling precise control of airflow rates to each component. The first airflow path includes a first fan for the IC and the second airflow path includes a second fan for optical devices, allowing independent adjustment of cooling parameters.
Solution Approach 2:
The patent introduces fan assemblies as intermediary control elements that regulate airflow rates. The first fan assembly controls airflow to the IC while the second fan assembly controls airflow to optical devices, providing a manageable interface for precise cooling control without overly complex ducting.
3Temperature
If conventional cooling methods are used without isolated airflow paths, then the system is simpler, but heat dissipation from ICs and optical devices is insufficient
Solution Approach 1:
The cooling system is segmented into dedicated airflow paths for different components. The first airflow path specifically targets the IC with direct airflow from the first fan, while the second airflow path targets optical devices with direct airflow from the second fan, maximizing heat dissipation efficiency for each component type.
Solution Approach 2:
The patent applies local quality by providing customized cooling solutions for different components. The IC receives cooling through a dedicated path with specific airflow characteristics, while optical devices receive cooling through a separate path optimized for their thermal requirements, rather than using a uniform cooling approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency by isolating airflow paths and allowing independent control of airflow rates, reducing fan power consumption and improving heat dissipation from ICs and other components.
Implementation Method 1
The vapor chamber is operable to transfer heat generated by the IC to front fins of the front fin stack
Implementation Method 2
transfer heat generated by the IC to front fins of the front fin stack
Implementation Method 3
The at least one fan is operable to move a first portion of an airflow through the upper slot and to the at least one fan, and to move a second portion of the airflow across the front fins
Data Source
AI summary
Vertical line card (VLC) systems are provided. In one aspect, a VLC system includes a vertically-oriented printed circuit board (PCB) defining a lower slot, an upper slot, and a plurality of holes. The VLC system also includes a vertically-oriented integrated circuit (IC) mounted to the PCB. The VLC further includes an IC heat sink having a front fin stack positioned forward of the vertically-oriented PCB. The VLC system also includes fans, cages mounted to the vertically-oriented PCB, and an IC duct. At least one fan is operable to move a first portion of an airflow through the upper slot and to the fan. At least one fan is operable to move a second portion of the airflow across the front fins, through the lower slot, and to the fan. The IC duct isolates the airflow from an airflow flowing through the cages and the holes to another fan of the fans.