Embedded Core Frame Package Structure for Warpage and IR Drop
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Solution Overview
Problem
High-Performance Computing (HPC) packages experience significant warpage due to increased size, which is mitigated by thickening package substrates, leading to longer electrical paths and IR drop degradation.
Innovation Solution
Incorporating a core frame that provides mechanical support without conductive through-holes, maintaining electrical routing efficiency by embedding it at the same level as the package components, thus reducing warpage without increasing electrical path lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the thickness of package substrates is increased to control warpage, then warpage resistance is improved, but electrical path length increases causing IR drop degradation
Solution Approach 1:
The package substrate is divided into multiple layers: a first package substrate, a second package substrate, and an intermediate substrate positioned between them. This segmentation allows the intermediate substrate to provide mechanical support for warpage control while the first and second substrates maintain electrical connectivity, thereby reducing electrical path length compared to a single thick substrate approach.
Solution Approach 2:
The invention introduces a vertical stacking dimension by placing the intermediate substrate between the first and second package substrates. This multi-layer vertical arrangement provides structural support in the thickness direction while maintaining horizontal electrical routing paths, effectively decoupling the mechanical support function from the electrical conduction path.
2Stability of the object's composition
If a core frame with conductive through-holes is used for mechanical support, then warpage is reduced, but electrical routing is disrupted increasing IR drop
Solution Approach 1:
The invention extracts the conductive through-holes from the intermediate substrate, creating a non-conductive core frame structure. This allows the core frame to provide mechanical support for warpage control without interfering with electrical routing, as the electrical connections are established through alternative pathways in the first and second package substrates.
Solution Approach 2:
The intermediate substrate acts as a non-conductive intermediary between the first and second package substrates. It provides mechanical support and structural stability for warpage control while allowing electrical signals to route through the adjacent first and second substrates, thus mediating between mechanical support requirements and electrical routing needs.
Data Source
AI summary
A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.