Embedded Core Frame Packaging for Warpage Control and Short RDL Paths

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

High-Performance Computing (HPC) packages experience significant warpage due to increased size, which is mitigated by thickening package substrates, but this leads to longer electrical paths and IR drop degradation.

Innovation Solution

A core frame is used to provide mechanical support without conductive paths through it, encapsulating the package component and redistributing lines are formed to connect electrically, maintaining mechanical support while preventing IR drop increase.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the thickness of package substrates is increased to control warpage, then warpage resistance is improved, but electrical path length increases causing IR drop degradation

Engineering Contradiction:

Improvewarpage resistanceVSAvoidelectrical path length

Core Design Contradiction:

Stability of the object's compositionVSLength of moving object

Solution Approach 1:

The package substrate is divided into two functional parts: a thin core substrate that provides electrical connectivity with short paths, and a thick frame substrate that provides mechanical support and warpage control. This segmentation allows each part to optimize its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the package structure are given different thicknesses based on their functional requirements. The central core region is kept thin to minimize electrical path length, while the peripheral frame region is made thick to provide warpage resistance. This local differentiation resolves the contradiction between electrical performance and mechanical stability.

Inventive Principle:

Principle #3Local quality

2Strength

If a thick core substrate is used to provide mechanical support, then warpage is controlled, but the electrical paths become longer and IR drop increases

Engineering Contradiction:

Improvemechanical supportVSAvoidIR drop

Core Design Contradiction:

StrengthVSLoss of energy

Solution Approach 1:

The structural support function is segmented from the electrical connectivity function. The frame substrate provides mechanical support while the core substrate handles electrical connectivity, eliminating the need for a single thick substrate to perform both functions simultaneously.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The mechanical support function is extracted from the core substrate and assigned to a separate frame substrate. This allows the core substrate to remain thin for optimal electrical performance while the frame substrate provides the necessary mechanical strength independently.

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS11984374B2Warpage control of packages using embedded core frame

Publication Date: 2024.05.14 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes placing a package component over a carrier. The package component includes a device die. A core frame is placed over the carrier. The core frame forms a ring encircling the package component. The method further includes encapsulating the core frame and the package component in an encapsulant, forming redistribution lines over the core frame and the package component, and forming electrical connectors over and electrically coupling to the package component through the redistribution lines.