Semiconductor Package Core Interconnect for Dense 3D Integration
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Solution Overview
Problem
The semiconductor industry faces challenges in integrating a high number of components within a compact device package while maintaining power and signal integrity, particularly in applications requiring high-speed data processing and complex calculations, due to limitations in packaging technologies such as Integrated Fan Out (InFO) and Wafer Level Packaging (WLP).
Innovation Solution
A method is developed to form a device package by bonding component devices on opposite sides of a core substrate with a pre-fabricated interconnect structure containing pre-soldered controlled collapse chip connection (C4) bumps, utilizing a redistribution structure and interconnect structure with varying conductive connectors to enhance electrical connections and reduce transmission losses, allowing for better integration and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If component devices are integrated at high density within a compact package, then functional density and computing performance are improved, but power and signal integrity deteriorate due to increased transmission losses
Solution Approach 1:
A core substrate is introduced as an intermediary carrier between component devices and the outer package structure. This core substrate includes an interconnect structure with conductive connectors (C4 bumps) that mediate electrical connections, allowing high-density integration while maintaining signal integrity through controlled impedance pathways and reduced transmission distances.
Solution Approach 2:
The patent transitions from planar two-dimensional packaging to three-dimensional vertical integration by bonding component devices on opposite sides of the core substrate. This dimensional change allows components to be stacked vertically rather than spread horizontally, reducing signal transmission distance and improving power and signal integrity while increasing functional density.
2Productivity
If contact pads are arranged at small pitch to increase I/O density, then functional integration is improved, but manufacturing precision and alignment difficulty worsen
Solution Approach 1:
The core substrate with pre-fabricated interconnect structure serves as an intermediary that decouples the alignment requirements between component devices and final contact pads. The C4 bumps on the core substrate act as intermediate connection points, allowing greater tolerance in alignment while achieving high I/O density through the redistribution structure.
Solution Approach 2:
The packaging structure is segmented into multiple functional layers: component devices, core substrate with interconnect structure, and outer package with contact pads. This segmentation allows each layer to be optimized independently - component devices for functionality, core substrate for interconnection, and outer package for I/O access - thereby achieving high I/O density without compromising manufacturing precision.
3Area of stationary object
If package size is reduced for miniaturization, then portability and integration are improved, but the number of available I/O pads and wiring capacity deteriorate
Solution Approach 1:
The patent utilizes three-dimensional vertical space by bonding component devices on opposite sides of the core substrate. This allows the package to maintain a compact footprint while increasing I/O capacity through vertical stacking, effectively trading horizontal area for vertical depth to achieve both miniaturization and high I/O density.
Solution Approach 2:
The core substrate serves multiple functions simultaneously: it acts as a mechanical carrier for component devices, provides electrical interconnection through C4 bumps, enables signal redistribution, and facilitates heat dissipation. This multi-functionality allows the compact package to maintain high I/O capacity without increasing package area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the integration of more component devices closer together, improving power and signal integrity, leading to enhanced computing performance and enabling faster data processing and complex calculations in high-performance computing applications.
Implementation Method 1
bonding component devices on opposite sides of a core substrate
Implementation Method 2
interconnect structure with varying conductive connectors to enhance electrical connections and reduce transmission losses
Implementation Method 3
pre-fabricated interconnect structure containing pre-soldered controlled collapse chip connection (C4) bumps
Data Source
AI summary
A method includes forming a redistribution structure on a carrier substrate, coupling a first side of a first interconnect structure to a first side of the redistribution structure using first conductive connectors, where the first interconnect structure includes a core substrate, where the first interconnect structure includes second conductive connectors on a second side of the first interconnect structure opposite the first side of the first interconnect structure, coupling a first semiconductor device to the second side of the first interconnect structure using the second conductive connectors, removing the carrier substrate, and coupling a second semiconductor device to a second side of the redistribution structure using third conductive connectors, where the second side of the redistribution structure is opposite the first side of the redistribution structure.