Semiconductor Package Core Member Roughness and Protrusion
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving improved rigidity and heat dissipation while maintaining cost-effectiveness and manufacturing simplicity, with traditional core members often leading to warpage and peeling issues due to differences in thermal expansion coefficients between materials.
Innovation Solution
A semiconductor package design featuring a core member with a metal frame and a plating layer having a surface roughness of 0.5 μm or more, which includes a through-hole accommodating a semiconductor chip and is surrounded by a redistribution substrate and encapsulant, enhancing adhesion and thermal transfer while reducing warpage and peeling risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a traditional core member with smooth surface is used, then the manufacturing process is simple, but the adhesion between core member and encapsulant is poor leading to peeling issues
Solution Approach 1:
The patent changes the surface roughness parameter of the core member from smooth to Ra 0.5 μm or more, which significantly improves adhesion strength between the core member and encapsulant while avoiding complex structural modifications. This parameter change directly addresses the peeling issue by enhancing interfacial bonding.
Solution Approach 2:
The patent applies local quality by creating a protruding portion with increased surface roughness (Ra 0.5 μm or more) at the specific location where adhesion is needed, while keeping other parts of the core member relatively simple. This localized surface modification improves bonding without requiring complex overall structure.
2Strength
If a core member with large area is used, then the rigidity is improved, but the warpage increases due to thermal expansion coefficient differences
Solution Approach 1:
The patent uses local quality by creating a protruding portion that extends from the core member into the encapsulant. This localized structural feature provides rigidity enhancement and stress distribution without requiring a large overall core member area, thereby reducing warpage caused by thermal expansion differences.
Solution Approach 2:
The patent creates a composite structure where the core member (with protruding portion) and encapsulant form an integrated assembly. The protruding portion acts as a mechanical interlock that combines the rigidity of the core member with the stress-absorbing capability of the encapsulant, reducing thermal warpage.
3Temperature
If the core member area is made smaller than redistribution substrate area, then the heat dissipation path is improved, but the structural support is reduced
Solution Approach 1:
The patent applies dimensionality change by extending the core member vertically through the protruding portion that penetrates into the encapsulant. This vertical extension compensates for the reduced horizontal area, maintaining structural support while allowing better heat dissipation pathways through the encapsulant material.
Solution Approach 2:
The patent uses the nesting principle where the protruding portion of the core member is nested within the encapsulant material. This configuration allows the core member to provide structural support through its vertical presence while the encapsulant provides additional heat dissipation pathways around and through the protruding portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved rigidity, reduced warpage, and enhanced heat dissipation performance, along with increased peeling strength between the core member and encapsulant, addressing the limitations of traditional packages.
Implementation Method 1
having a plating layer having a surface roughness (Ra) of 0.5 μm or more on a surface of the metal frame
Implementation Method 2
The protruding portion of the core member has a surface exposed to a side surface of the encapsulant
Implementation Method 3
having improved rigidity and heat dissipation characteristics
Data Source
AI summary
A semiconductor package includes a core member having a first surface and a second surface opposing each other, and an external side surface between the first and second surfaces, the core member having a through-hole connecting the first and second surfaces, having a protruding portion that protrudes from the external side surface, and having a surface roughness (Ra) of 0.5 μm or more, a redistribution substrate on the first surface of the core member, and including a redistribution layer; a semiconductor chip in the through-hole on the redistribution substrate, and having a contact pad electrically connected to the redistribution layer, and an encapsulant on the redistribution substrate, and covering the semiconductor chip and the core member, the protruding portion of the core member having a surface exposed to a side surface of the encapsulant.