Core-Shell Dielectric Composition for Reliable Multilayer Capacitors

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Solution Overview

Problem

Multilayer ceramic capacitors face challenges in achieving smaller size, higher reliability, and improved electrical properties, especially when exposed to high heat and vibrations in automotive applications.

Innovation Solution

A multilayer electronic component with a dielectric layer composed of calcium (Ca), strontium (Sr), zirconium (Zr), titanium (Ti), manganese (Mn), yttrium (Y), and silicon (Si) with a core-shell structure in the dielectric grains, where Ys/Yc > 9, enhances dielectric properties and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the dielectric layer uses a simple composition, then the manufacturing process is simpler, but the dielectric properties and reliability are insufficient

Engineering Contradiction:
Improvedielectric properties and reliabilityVSAvoidcomposition complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The dielectric layer employs a composite material system consisting of Ca-Zr-Ti-O base material combined with Mn-Y-Si dopants. This composite approach enables simultaneous improvement of dielectric constant, quality factor, and breakdown voltage through synergistic effects of multiple elements, resolving the contradiction between enhanced reliability and composition complexity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The invention introduces a core-shell structure in dielectric grains where the core contains Ca-Zr-Ti-O with specific dopant concentrations and the shell has different compositional characteristics. This local differentiation of material properties within the grain structure optimizes both dielectric performance and manufacturing feasibility by concentrating complex composition only where necessary.

Inventive Principle:
Principle #3Local quality

2Volume of moving object

If the chip size is reduced, then the product size is smaller, but the electrical properties and reliability deteriorate

Engineering Contradiction:
Improvechip sizeVSAvoidelectrical properties and reliability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The invention optimizes critical parameters including the Ys/Yc ratio (shell-to-core yttrium content ratio greater than 9), dopant concentrations (Mn: 0.01-5 mol%, Y: 0.01-5 mol%, Si: 0.01-5 mol%), and grain size distribution. These parameter optimizations enable miniaturization while maintaining electrical properties by enhancing dielectric constant and breakdown voltage at smaller scales.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The composite Ca-Zr-Ti-O system with Mn-Y-Si dopants provides superior electrical properties that enable chip miniaturization. The composite structure maintains high dielectric constant and breakdown voltage even at reduced chip dimensions, resolving the contradiction between small size and reliable electrical performance.

Inventive Principle:
Principle #40Composite materials

3Adaptability or versatility

If the electronic component is exposed to high heat and vibrations, then the operational capability is maintained, but the reliability decreases

Engineering Contradiction:
Improveoperational capability under stressVSAvoidreliability under stress
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The Mn-Y-Si dopants serve as a protective mechanism against high heat and vibrations. The dopants create a more stable crystal structure and reduce defect formation during thermal and mechanical stress, effectively cushioning the base material against degradation from environmental stressors before damage occurs.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The invention optimizes compositional parameters (dopant types and concentrations) and microstructural parameters (grain size, core-shell structure) to enhance thermal and mechanical stability. These parameter optimizations enable the component to maintain reliability under high heat and vibration conditions by improving structural resilience.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20260051441A1Multilayer electronic component
Publication Date: 2026.02.19 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20260051441A1 patent drawing
  • US20260051441A1 patent drawing
  • US20260051441A1 patent drawing

AI summary

A body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer interposed therebetween; and external electrodes disposed on the body, wherein the dielectric layer includes a main component containing calcium (Ca), strontium (Sr), zirconium (Zr) and titanium (Ti) and a sub-component containing manganese (Mn), yttrium (Y) and silicon (Si), wherein the dielectric layer includes a plurality of dielectric grains and grain boundaries disposed between adjacent dielectric grains, and at least a portion of the plurality of dielectric grains has a core-shell structure, a content of yttrium (Y) included in a core relative to 100 moles of zirconium (Zr) included in the core and a shell is defined as Yc, a content of yttrium (Y) included in the shell relative to 100 moles of zirconium (Zr) included in the core and the shell is defined as Ys, and Ys/Yc>9 is satisfied.