Core-Shell PCM Thermal Compensation Layers for Power Electronics Heat Spikes
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Solution Overview
Problem
Power electronics devices face challenges in managing heat removal due to limited thermal conduction at high operating temperatures, which can lead to thermal damage, especially as temperatures approach 200°C in high-power applications like hybrid electric vehicles.
Innovation Solution
A thermal compensation layer incorporating a metal inverse opal (MIO) layer with core-shell phase change particles is used, where the core has a phase change material with a temperature range of 100°C to 250°C and a shell with a higher melt temperature, embedded within a metal MIO layer, enhancing heat capacity and heat removal capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal conduction is used to remove heat from power electronics devices, then heat removal is achieved, but the rate of heat removal is limited at high operating temperatures approaching 200°C
Solution Approach 1:
The patent incorporates phase change material (PCM) particles that undergo phase transition at temperatures between 100°C and 250°C, which is the operating temperature range of power electronics devices. During the phase change process, the PCM absorbs latent heat from the devices, significantly increasing the heat removal rate without requiring temperature increase. This directly addresses the limitation of thermal conduction at high temperatures by providing an additional heat absorption mechanism through phase transition.
Solution Approach 2:
The patent uses composite particles consisting of PCM core surrounded by a shell material. The composite structure combines the high latent heat capacity of PCM with the thermal conductivity and structural stability of the shell material, creating a material that effectively transfers heat from power electronics devices while maintaining mechanical integrity at high temperatures.
2Power
If operating temperature is increased to improve power output, then power electronics device performance is improved, but thermal damage risk increases
Solution Approach 1:
The phase change material particles are pre-positioned within the thermal compensation layer in contact with or near the power electronics devices. Before thermal damage can occur, the PCM particles are already in place to absorb excess heat through phase transition when temperature reaches the PCM's phase change point, preventing temperature from rising to damaging levels and thereby protecting the devices.
Solution Approach 2:
The thermal compensation layer containing PCM particles acts as an intermediary thermal management system between the power electronics devices and the environment. The PCM particles serve as a thermal buffer that mediates heat transfer, absorbing heat during phase change and releasing it during solidification, thereby regulating temperature and protecting devices from thermal damage while allowing high power operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal compensation layer effectively increases heat capacity, allowing for more efficient heat removal from power electronics devices, maintaining lower temperatures and reducing the risk of thermal damage during high heat output periods.
Implementation Method 1
Each of the core-shell PC particles includes a core that includes a phase change material (PCM) that may have a PC temperature in a range of from 100° C. to 250° C.
Implementation Method 2
the core includes a phase change material (PCM) that may have a PC temperature in a range of from 100° C. to 250° C.
Implementation Method 3
The heat generated through operation of the power electronics devices is thermally conducted away from the electronics devices to prevent damage
Data Source
AI summary
A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.