Core-Shell Photovoltaic Packaging for Self-Powered Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of semiconductor packages is limited by the need for external power sources, and existing designs face challenges in providing a semi-permanent power supply, especially in IoT environments where independent sensor devices and communication devices require continuous power.
Innovation Solution
The semiconductor packaging incorporates photovoltaic particles with a core-shell structure, allowing for self-sustaining power generation by connecting these particles in series or parallel, and integrating them between the semiconductor chip and the substrate, along with reflection portions to enhance light absorption and power production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If external power sources are connected to semiconductor packages, then power supply is ensured, but miniaturization is limited due to additional connection structures
Solution Approach 1:
The patent merges the power generation function directly into the semiconductor package by integrating photovoltaic particles within the package structure. This combines the semiconductor chip, power generation elements, and power storage components into a single integrated unit, eliminating the need for external power source connections and enabling miniaturization while ensuring autonomous power supply.
Solution Approach 2:
The semiconductor package becomes self-sufficient by incorporating photovoltaic particles that generate power autonomously from ambient light. The package generates its own power through the photovoltaic effect and stores it in integrated power storage elements, eliminating dependence on external power sources and enabling independent operation especially in IoT applications.
2Duration of action of stationary object
If separate power supply devices are integrated into semiconductor packages, then semi-permanent power supply is achieved, but device complexity increases
Solution Approach 1:
The patent implements a nested structure where photovoltaic particles are positioned between the substrate and semiconductor chip, with power storage elements integrated within the package volume. This nested arrangement allows multiple functional components to be stacked vertically, achieving semi-permanent power supply while maintaining a compact form factor and managing structural complexity through three-dimensional integration.
3Volume of moving object
If photovoltaic particles are integrated between semiconductor chip and substrate, then miniaturization is enabled, but light absorption efficiency may be reduced
Solution Approach 1:
The patent positions photovoltaic particles in the vertical dimension between the substrate and semiconductor chip, utilizing the z-axis space that would otherwise be empty. This three-dimensional integration enables power generation without increasing the package footprint, achieving miniaturization while maintaining power generation efficiency through strategic placement in the vertical dimension.
Solution Approach 2:
The patent uses particle-sized photovoltaic elements instead of continuous photovoltaic layers, allowing discrete placement and optimization of light absorption paths. The segmented particle structure enables efficient light capture while maintaining transparency to certain wavelengths, balancing power generation efficiency with miniaturization requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the semiconductor package to autonomously generate and store power, overcoming miniaturization limitations and preventing data loss due to external power cutoffs, while allowing for easy adjustment of voltage and current requirements.
Implementation Method 1
semiconductor packaging capable of supplying power by itself by photovoltaic power generation
Implementation Method 2
reflection portions, and the reflection portions may be formed around the power generation connection layer on the substrate
Data Source
AI summary
The present disclosure relates to a semiconductor packaging capable of supplying power by itself by including, as a power supply part, photovoltaic particles having a core-shell structure, wherein the photovoltaic particles in a semiconductor package generate voltage and current required for semiconductors so that the semiconductor package can be easily driven only with the power generated by itself, it is possible to overcome the restrictions on miniaturization of semiconductor packages due to connection with external power sources, and the photovoltaic particles are located between a semiconductor chip and a substrate so that the semiconductor package is easy to miniaturize.