Core-Shell Photosensitive Resin for Fine CMOS Color Filter Patterning
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Solution Overview
Problem
The development of ultra-down-sized and ultra-power-saving image sensors for CMOS image sensors faces challenges in manufacturing fine patterns due to the limitations of pigment-based color filters, particularly in terms of chemical resistance and processability, especially as pixel sizes decrease.
Innovation Solution
A core-shell compound is introduced, featuring a squarylium-based core with epoxy or siloxane groups and a surrounding shell, which forms a photosensitive resin composition that maintains excellent chemical resistance even after curing and thermal processes, suitable for use in CMOS image sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pigment-based color filters are used in CMOS image sensors, then color filtering function is achieved, but chemical resistance deteriorates and processability becomes difficult especially as pixel sizes decrease
Solution Approach 1:
The patent uses a core-shell compound where a squarylium-based core (providing color filtering) is combined with a shell containing epoxy or siloxane groups (providing chemical resistance). This composite structure allows the material to simultaneously achieve excellent chemical resistance and color filtering functionality, resolving the contradiction between reliability and ease of manufacture.
2Volume of moving object
If pixel sizes are reduced to achieve ultra-down-sized image sensors, then device miniaturization is achieved, but manufacturing precision deteriorates due to limitations in forming fine patterns
Solution Approach 1:
The patent changes the chemical parameters of the color filter material by introducing epoxy and siloxane groups, which improve the material's chemical resistance and processability. This allows for precise patterning even at reduced pixel sizes, enabling ultra-down-sized sensors while maintaining manufacturing precision.
3Reliability
If thermal processes are applied to cure the photosensitive resin, then crosslinking and chemical resistance are improved, but material stability may deteriorate if the compound structure is not optimized
Solution Approach 1:
The patent incorporates epoxy or siloxane groups into the compound structure before the thermal curing process. These groups are pre-positioned to undergo crosslinking reactions during the subsequent thermal process, ensuring that the material achieves enhanced chemical resistance while maintaining stability. The preliminary structural design prevents degradation during curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The core-shell compound enhances chemical resistance and allows for the formation of fine patterns, improving the performance and reliability of green color filters in CMOS image sensors by maintaining high transmittance and contrast ratios.
Implementation Method 1
a photopolymerizable group
Data Source
AI summary
A core-shell compound, a photosensitive resin composition including the same, a photosensitive resin layer produced using the photosensitive resin composition, a color filter including the photosensitive resin layer, and a CMOS image sensor including the color filter, the core-shell compound including a core represented by Chemical Formula 1; and a shell surrounding the core, the shell being represented by Chemical Formula 2: