Core-Shell Silver Particles for High-Temperature Semiconductor Bonding
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Solution Overview
Problem
Conventional bonding materials such as solders and silver pastes exhibit insufficient reliability and heat dissipation, making them unsuitable for high-temperature applications in semiconductor elements.
Innovation Solution
The development of silver particles comprising a silver powder with a silver layer of smaller primary particles, produced through a liquid phase reduction method, which form a paste composition that enhances thermal conductivity and adhesive properties, allowing for reliable bonding at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding materials (solders and silver pastes) are used, then the bonding process is simple, but the reliability and heat dissipation are insufficient for high-temperature applications
Solution Approach 1:
The patent uses composite silver particles consisting of a core silver powder and a shell layer of aggregated primary silver particles. This composite structure combines the benefits of different particle sizes and morphologies to achieve both high reliability and superior heat dissipation at high temperatures, resolving the contradiction between bonding reliability and thermal performance.
Solution Approach 2:
The silver particles exhibit local quality differentiation with a core region (silver powder) and a shell region (aggregated primary particles). The core provides structural integrity and bonding strength, while the shell enhances thermal conductivity and heat dissipation, allowing the material to simultaneously satisfy both reliability and temperature-related requirements.
2Reliability
If silver nanoparticles are used for low-temperature firing, then electrical conductivity is improved, but heat dissipation at high temperatures becomes insufficient
Solution Approach 1:
The silver particle structure is segmented into distinct components: a core silver powder and a shell of aggregated primary particles. This segmentation allows each component to contribute differently to the overall performance, with the structure providing both good electrical conductivity (from the silver content) and enhanced high-temperature heat dissipation (from the aggregated shell structure).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The silver particles provide excellent thermal conductivity and adhesive properties, resulting in semiconductor devices with improved reliability and heat dissipation, suitable for high-temperature operations.
Implementation Method 1
forming a silver layer over a surface of a silver powder (A) by a liquid phase reduction method
Data Source
AI summary
Provided are silver particles including a silver powder and a silver layer that includes primary particles, the primary particles being smaller than the silver powder.