Core-Shell Nanoparticle Solder Composition for Thermal Cycle Reliability

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Solution Overview

Problem

Existing solder compositions used in semiconductor packaging face challenges in maintaining reliability and performance due to phase separation of nanoparticles, leading to reduced shear strength over thermal cycles.

Innovation Solution

A solder composition incorporating spherical nanoparticles with a metal oxide core having a density of 7 g/cm³ or more and a melting point of 2000°C or higher, synthesized using a hydrothermal process, and coated with a metal layer, is mixed with a solder paste comprising tin-bismuth or tin-silver-copper alloys.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional solder compositions are used, then manufacturing simplicity is maintained, but nanoparticle phase separation occurs leading to reduced shear strength over thermal cycles

Engineering Contradiction:
Improveshear strengthVSAvoidreliability over thermal cycles
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent employs composite nanoparticles consisting of a metal oxide core (such as CeO2, TiO2, or SiO2) coated with a metal shell (such as Ag, Au, or Cu). This composite structure prevents phase separation of nanoparticles during thermal cycling while maintaining or enhancing shear strength. The core-shell configuration allows the nanoparticles to remain dispersed in the solder matrix without aggregating, thus resolving the contradiction between strength and reliability over thermal cycles.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent modifies the physical and chemical parameters of the nanoparticles by controlling their size (10-100 nm diameter), composition (metal oxide core with metal shell), and surface properties. These parameter changes ensure that the nanoparticles remain stable and do not phase separate during thermal cycling, thereby maintaining both shear strength and reliability over time.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If high-performance nanoparticles are added to solder paste, then shear strength and reliability are improved, but manufacturing complexity increases

Engineering Contradiction:
ImprovereliabilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-synthesizing the core-shell structured nanoparticles before incorporating them into the solder paste. The nanoparticles are prepared in advance with controlled size, composition, and surface properties, which simplifies the subsequent mixing and manufacturing processes. This pre-preparation ensures that the nanoparticles are ready for direct incorporation without requiring complex in-situ synthesis or additional processing steps.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses a surfactant or coupling agent as an intermediary substance to facilitate the uniform dispersion of the core-shell nanoparticles in the solder paste matrix. This intermediary prevents agglomeration and ensures homogeneous distribution, thereby simplifying the manufacturing process while maintaining the reliability benefits of the high-performance nanoparticles.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The improved solder composition enhances shear strength properties and reliability by preventing nanoparticle phase separation, maintaining performance even after thermal cycling.

Implementation Method 1

the synthesizing of the nanoparticle includes synthesizing the core using a hydrothermal synthesis process

Methodology Applied
Scientific EffectHydrothermal synthesis:

Data Source

PatentUS20250214181A1Solder composition, method of preparing the same, and method of manufacturing semiconductor package using the solder composition
Publication Date: 2025.07.03 SAMSUNG ELECTRONICS CO LTD
  • US20250214181A1 patent drawing
  • US20250214181A1 patent drawing
  • US20250214181A1 patent drawing

AI summary

A solder composition includes a solder paste including a tin (Sn)-bismuth (Bi) alloy and/or a tin (Sn)-silver (Ag)-copper (Cu) alloy and a plurality of nanoparticles dispersed in the solder paste, wherein each of the nanoparticles includes a core that is spherical, the core includes a metal oxide, and the metal oxide has a density of 7 g/cm3 or more and a melting point of 2000° C. or higher.