Core-Shell TSVs for RF Antenna Impedance Matching
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Solution Overview
Problem
High-frequency signal transmission in semiconductor devices faces challenges due to impedance matching issues and cross-talk, leading to power loss and reduced efficiency, especially in packaging where shielding is difficult and antennas require significant space.
Innovation Solution
The use of Through-Silicon Vias (TSVs) and Through-Mold Vias (TMVs) with a lower resistance outer layer, such as silver or graphene, and a conductive core, configured in various designs like coaxial, twin lead, waveguide, or strip-line configurations to minimize impedance matching losses and reduce space requirements for antennas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional metal fills (copper, aluminum) are used in TSVs, then manufacturing is simple and cost-effective, but RF performance deteriorates due to higher resistance and power loss
Solution Approach 1:
The patent applies composite materials by filling TSVs with a core-shell structure consisting of a copper or aluminum core surrounded by a silver or graphene shell. This composite structure combines the ease of manufacturing copper/aluminum with the superior RF performance of silver/graphene, achieving low power loss while maintaining manufacturing feasibility through sequential deposition processes.
Solution Approach 2:
The patent applies local quality by using a core-shell structure where the inner core material (copper or aluminum) provides structural support and ease of manufacturing, while the outer shell material (silver or graphene) provides superior electrical conductivity and RF performance. Each material is optimally positioned to发挥 its specific advantages, resolving the contradiction between manufacturing simplicity and RF performance.
2Area of moving object
If antennas are placed close to circuitry to minimize space, then device form factor is reduced, but RF performance deteriorates due to cross-talk and external interference
Solution Approach 1:
The patent applies the intermediary principle by using TSVs with optimized impedance characteristics as mediators between the antenna and circuitry. These vias with core-shell structures provide improved impedance matching and reduced signal loss, enabling closer placement of antennas to circuitry while maintaining RF performance by minimizing cross-talk and external interference through better signal integrity.
Solution Approach 2:
The patent applies parameter changes by modifying the electrical parameters of the TSVs through the use of core-shell structures with different material compositions. The impedance, conductivity, and signal loss characteristics of the vias are optimized to enable closer antenna-circuitry integration while maintaining RF performance, effectively resolving the space versus interference contradiction.
3Reliability
If TSVs are filled with simple metals, then manufacturing process is simple, but RF performance is limited due to impedance matching losses
Solution Approach 1:
The patent applies composite materials by using a core-shell structure with copper or aluminum core and silver or graphene shell in the TSVs. This composite structure improves RF performance and impedance matching while maintaining manufacturing feasibility through established deposition techniques, effectively resolving the contradiction between reliability and device complexity.
Solution Approach 2:
The patent applies self-service by designing the core-shell structure where the inner core material provides structural integrity and ease of manufacturing, while the outer shell material self-provides superior electrical conductivity and RF performance. The structure serves multiple functions through its layered design, reducing the need for additional components or complex processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances RF performance by reducing power losses, minimizing space for antennas, and improving mobile device layouts with reduced cross-talk and external interference, allowing for smaller form factors and better impedance matching.
Implementation Method 1
The use of Through-Silicon Vias (TSVs) and Through-Mold Vias (TMVs) with a lower resistance outer layer, such as silver or graphene, and a conductive core
Implementation Method 2
High-frequency signal transmission in semiconductor devices faces challenges due to impedance matching issues and cross-talk, leading to power loss
Implementation Method 3
The via has parallel concentric conducting paths isolated by a dielectric
Implementation Method 4
configured in various designs like coaxial, twin lead, waveguide, or strip-line configurations to minimize impedance matching losses
Data Source
AI summary
Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.