Core-Shell Wave-Absorbing Sheet for Thin Electronic Devices
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Solution Overview
Problem
Conventional wave-absorbing materials are heavy, expensive, and lack flexibility, making them unsuitable for wideband electromagnetic wave absorption, particularly in applications like RFID tags and electronic device protection, where they often increase device thickness and reduce reading distances due to electromagnetic interference.
Innovation Solution
A method involving the creation of a thin, light, flexible wave-absorbing sheet by blending wave-absorbing particles with a graphene solution, mixing with a resin solution and an interface modifier, applying the mixture to conductive substrates under voltage, and then removing and drying the substrates to produce a sheet with core-shell structured particles that effectively absorb electromagnetic waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional wave-absorbing materials (metal powders mixed with adhesive) are used, then wave absorption function is achieved, but the material becomes heavy and expensive
Solution Approach 1:
The patent changes the physical and chemical parameters of the wave-absorbing material by using core-shell structured particles with specific shell thickness (100-550 nm) and composition (phosphorus ferronickel, NiMoFeP, iron phosphide or nickel phosphide). This parameter optimization achieves high wave absorption efficiency while reducing material density and weight compared to conventional metal powder composites.
Solution Approach 2:
The invention creates a composite material system consisting of core-shell structured wave-absorbing particles embedded in a resin matrix with graphene enhancement. The core-shell structure combines a plastic core (acrylic resin, polystyrene, polymethylmethacrylate, poly-epoxy resin or silicon dioxide) with a magnetic metal shell, forming a composite that achieves superior electromagnetic wave absorption with reduced weight and cost compared to solid metal materials.
2Object-affected harmful factors
If metal wave-absorbing materials are used, then electromagnetic wave absorption is achieved, but the cost increases
Solution Approach 1:
The patent optimizes the shell thickness parameter to 100-550 nm and controls the shell weight percentage at 10-80 wt% of each particle, achieving high electromagnetic wave absorption efficiency with minimal metal content. This parameter control reduces material cost while maintaining performance.
Solution Approach 2:
The invention replaces expensive solid metal materials with core-shell structured particles where only the thin shell (100-550 nm) contains magnetic metal, while the core is made of inexpensive plastics. This substitution dramatically reduces material cost while maintaining wave absorption functionality.
3Object-affected harmful factors
If conventional wave-absorbing materials are used, then absorption function is achieved, but flexibility and thinness are compromised
Solution Approach 1:
The patent creates a thin-film wave-absorbing sheet by dispersing core-shell particles (100 nm to 50 micrometers diameter) in a resin matrix and applying them to conductive substrates. The resulting sheet is thin, flexible, and lightweight, overcoming the rigidity and thickness problems of conventional metal-based wave-absorbing materials.
Solution Approach 2:
The invention controls particle size parameters (100 nm to 50 micrometers) and shell thickness (100-550 nm) to enable the creation of thin, flexible sheets that maintain high wave absorption efficiency while achieving the desired flexibility and thinness for modern electronic device applications.
4Object-affected harmful factors
If wave-absorbing materials are applied to protect electronic devices, then electromagnetic interference protection is achieved, but device thickness increases
Solution Approach 1:
The patent produces ultra-thin wave-absorbing sheets by applying core-shell particle dispersions to conductive substrates and then removing the substrates. The resulting free-standing thin films provide effective electromagnetic interference protection with minimal thickness, suitable for integration into thin electronic devices like RFID tags and mobile phones.
Solution Approach 2:
The invention optimizes particle concentration (0.1%-5% wave-absorbing particles in graphene solution), resin concentration (0.1%-5%), and interface modifier concentration (100-400 gram/l) to achieve effective wave absorption in ultra-thin sheet configurations, minimizing the thickness added to electronic devices while maintaining protection effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting sheet exhibits excellent thermal stability, mechanical properties, and high absorption efficiency across a wide frequency band, allowing for thinner, more efficient protection of electronic devices from electromagnetic interference while maintaining a lightweight and cost-effective design.
Implementation Method 1
providing the wave-absorbing particles, resin solution and graphene solution of the third emulsified mixture evenly on two conductive substrates by submerging the conductive substrates in the third emulsified mixture and imposing voltage on the conductive substrates
Implementation Method 2
A wave-absorbing material absorbs electromagnetic wave, transforms the electromagnetic energy into heat, and scatters the heat
Implementation Method 3
Wave-absorbing materials are made of iron cores, ferrites, silver/nickel and iron/aluminum/silicon. The metal is grounded into powder and mixed with adhesive for use
Data Source
AI summary
In a method for making a wave-absorbing sheet, first emulsified mixture is provided by mixing wave-absorbing particles with graphene solution so that the graphene solution absorbs the wave-absorbing particles. Secondly, second emulsified mixture is provided by adding and blending resin solution in the first emulsified mixture. Thirdly, third emulsified mixture is provided by adding and blending interface modifier in the second emulsified mixture. Then, two conductive substrates are submerged in the third emulsified mixture, and voltage is provided to the third emulsified mixture so that the wave-absorbing particles, the resin solution and the graphene solution are evenly coated on the conductive substrates. Then, a wave-absorbing sheet is provided by eroding and removing the conductive substrates. Finally, the wave-absorbing sheet is washed and dried. The wave-absorbing sheet is thin, light and flexible, and exhibits a wide absorption frequency band and a high absorption rate.