Core-Substrate Protective Area Structure Against Packaging Breakage
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Solution Overview
Problem
Semiconductor packaging substrates face challenges in preventing breakage during manufacturing processes, particularly due to stress accumulation from heat and pressure, leading to damage and reduced yield, especially with ceramic and glass substrates which are prone to breaking under external impact.
Innovation Solution
A core-substrate design with a protective area comprising concaves or vias around the product area to absorb and redirect impact, reducing the likelihood of damage and improving yield, using materials like silicon-based ceramic or glass substrates with specific thickness ranges and configurations for enhanced protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic or glass substrates are used for semiconductor packaging, then electrical performance is improved, but susceptibility to breakage during manufacturing increases
Solution Approach 1:
The substrate is segmented into a product area and a protective area, where the protective area is divided into multiple regions with concaves or vias. This segmentation allows the protective area to independently absorb impact energy through controlled deformation, preventing stress transmission to the product area while maintaining the electrical performance benefits of ceramic or glass materials in the product area.
Solution Approach 2:
The protective area is designed with concaves or vias beforehand to create cushioning zones that absorb impact energy before it reaches the product area. These pre-designed features act as energy dissipation structures that deform under impact, reducing the force transmitted to the fragile product area and preventing breakage during manufacturing processes.
2Strength
If the substrate thickness is increased to prevent breakage, then strength is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of uniformly increasing substrate thickness throughout, the invention applies local quality by creating concaves or vias only in the protective area. This localized structural modification provides enhanced impact absorption where needed (at the edges and corners susceptible to impact) while keeping the product area thickness optimized for electrical performance, thereby avoiding unnecessary complexity and cost.
Solution Approach 2:
The substrate employs a composite structure combining the product area (made of ceramic or glass for electrical performance) with the protective area (featuring concaves or vias for mechanical protection). This composite design integrates materials and structures with different functions, achieving both electrical performance and breakage resistance without requiring uniform thickening of the entire substrate.
3Reliability
If a protective structure is added to prevent breakage, then reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The concaves or vias in the protective area are formed during the substrate manufacturing process itself, before the semiconductor devices are mounted. This preliminary action integrates the protective structure creation into the existing manufacturing workflow, avoiding the need for separate post-processing steps and minimizing additional manufacturing complexity while ensuring reliability.
Data Source
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Figure 4B~5A
AI summary
The present disclosure relates to a core-substrate (100), a substrate, a use of the substrate, and a semiconductor device comprising the same, wherein the core-substrate (100) is a core-substrate applied to the manufacture of a semiconductor packaging substrate, and the core-substrate (100) distinguished into a product area (10) where a product utilized as a substrate of an individual semiconductor is disposed; and a blank area excepting for the product area, wherein the blank area comprises a protective area (25) disposed between the product area (10) and the substrate, and the protective area (25) comprises a concave (251, 255) or a via. The embodiment can substantially suppress the occurrence of damage in the product area utilized as a substrate for semiconductor packaging, even though a core-substrate which may be easily broken by external impact.