Core Substrate Bridge Structure for Uniform Package Molding
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Solution Overview
Problem
The increasing integration of I/O terminals in semiconductor chips leads to interference due to reduced distances, necessitating a fan-out semiconductor package to increase terminal spacing.
Innovation Solution
A core substrate with a substrate base featuring cavities and bridge structures, accommodating semiconductor chips and a molding layer, where the substrate, blocks, and bridge structures are made of the same material, with blocks and bridge structures extending between blocks and the substrate base to manage molding layer thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the distance between I/O terminals is reduced to increase integration, then the number of I/O terminals increases, but interference between I/O terminals occurs
Solution Approach 1:
The patent transitions from a planar substrate to a three-dimensional structure by adding vertical height through the molding layer (50 µm to 200 µm). This dimensional change allows I/O terminals to be spaced farther apart in the vertical dimension while maintaining high integration, thereby reducing interference between terminals.
2Manufacturing precision
If dummy chips are used to maintain molding layer thickness uniformity, then molding layer thickness uniformity is achieved, but manufacturing cost increases
Solution Approach 1:
The patent removes the unnecessary dummy chips from the substrate and instead uses bridge structures (130) connecting blocks (120) to the substrate base (110) to maintain molding layer thickness uniformity. This extraction of the dummy chip concept eliminates the associated manufacturing costs while achieving the same technical effect of uniform molding layer thickness.
Solution Approach 2:
The patent replaces expensive dummy chips with simpler, cheaper bridge structures that serve the same functional purpose of maintaining molding layer thickness. The bridge structures are simpler components that can be manufactured more economically while achieving the desired uniformity in molding layer thickness across the substrate surface.
3Adaptability or versatility
If various structures (substrate base, blocks, bridge structures) are made of different materials, then functional requirements are met, but manufacturing complexity increases
Solution Approach 1:
The patent merges the substrate base (110), blocks (120), and bridge structures (130) into a single integrated structure made of the same material. This consolidation reduces manufacturing complexity by eliminating the need for multiple material handling processes, while the structural design (cavities and bridge configurations) maintains the necessary functional differentiation.
Solution Approach 2:
The patent creates a universal material system where a single material serves multiple functions: the substrate base provides structural support, the blocks define cavity boundaries, and the bridge structures maintain spacing and structural integrity. This multi-functional use of a single material simplifies manufacturing while maintaining all required functional properties.
Data Source
AI summary
A package structure includes a core substrate including a substrate base including a plurality of first cavities and a plurality of second cavities, a plurality of blocks in the plurality of second cavities; and a plurality of bridge structures that extend between each of the plurality of blocks and the substrate base, a plurality of semiconductor chips in the plurality of first cavities, and a molding layer configured to cover the core substrate and the plurality of semiconductor chips, a portion of the molding layer being in the plurality of first cavities and the plurality of second cavities.