Core-Substrate Protective Area for Breakage-Resistant Packaging
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Solution Overview
Problem
Semiconductor packaging substrates face challenges in preventing breakage during manufacturing processes, particularly due to stress accumulation from heat and pressure, leading to damage and reduced yield, especially with ceramic and glass substrates which are prone to breaking under external impact.
Innovation Solution
A core-substrate design with a protective area surrounding the product area, featuring concaves or vias that act as stoppers to prevent damage from spreading internally, and filled with insulating or heat radiating materials to reduce stress, improving the substrate's durability and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic or glass substrates are used for high-performance semiconductor packaging, then electrical characteristics are improved, but the substrate is prone to breakage during manufacturing processes
Solution Approach 1:
The patent applies beforehand cushioning by forming a protective area with concaves or vias around the product area before the substrate is subjected to manufacturing processes. This protective structure acts as a buffer that absorbs external impacts and prevents stress from propagating to the product area, thereby preventing breakage while maintaining the electrical characteristics of ceramic and glass substrates
Solution Approach 2:
The patent applies local quality by creating a protective area with different structural characteristics (concaves or vias) specifically around the product area, while the product area itself maintains its original high-performance material properties. This localized structural modification provides enhanced protection without compromising the electrical characteristics of the semiconductor packaging substrate
2Productivity
If protective structures are added to prevent breakage, then manufacturing yield is improved, but substrate complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the substrate into distinct functional areas: a product area for semiconductor mounting and a protective area with concaves or vias. This segmentation allows the protective function to be implemented as a separate structural element that can be formed through standard manufacturing processes, adding minimal complexity while significantly improving manufacturing yield
Data Source
AI summary
The present disclosure relates to a core-substrate, a substrate, a use of the substrate, and a semiconductor device comprising the same, wherein the core-substrate is a core-substrate applied to the manufacture of a semiconductor packaging substrate, and the core-substrate distinguished into a product area where a product utilized as a substrate of an individual semiconductor is disposed; and a blank area excepting for the product area, wherein the blank area comprises a protective area disposed between the product area and the substrate, and the protective area comprises a concave or a via. The embodiment can substantially suppress the occurrence of damage in the product area utilized as a substrate for semiconductor packaging, even though a core-substrate which may be easily broken by external impact.