Power Converter Core Heat Dissipation via Surface Contact
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Solution Overview
Problem
The existing circuit device with a transformer and smoothing choke experiences inadequate heat dissipation due to a small contact area between the plate spring and the core, leading to increased core temperature and thermal losses.
Innovation Solution
A circuit device with a core and a coil surrounding it, featuring a first heat transfer member in surface contact with the core, which increases the contact area and reduces thermal resistance for effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a plate spring is used to press the core against the metal housing, then the structure is simple and easy to manufacture, but the contact area between the heat transfer member and the core is small, resulting in insufficient heat dissipation
Solution Approach 1:
The patent transitions from line contact (1D) to surface contact (2D) between the heat transfer member and the core. The plate spring is modified to include a plate-like heat transfer member that contacts the core over a large surface area, fundamentally changing the dimensional nature of the contact interface and thereby significantly improving heat dissipation capability.
Solution Approach 2:
The patent changes the contact area parameter from small (line contact) to large (surface contact). By modifying the plate spring to have an extended plate-like structure with increased contact surface area, the thermal resistance is reduced and heat dissipation is enhanced, directly addressing the temperature problem.
2Device complexity
If a plate spring with small contact area is used, then the device complexity is low, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The plate spring is transformed into a multi-functional component: it retains its original pressing function while simultaneously serving as a heat transfer member. The plate-like structure enables both mechanical support and thermal conduction functions to be integrated into a single component, reducing device complexity while improving heat dissipation.
Solution Approach 2:
The plate spring structure serves itself by incorporating the heat transfer function directly into the pressing component. The same plate-like structure that provides mechanical pressing also conducts heat away from the core, eliminating the need for separate heat dissipation components and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The surface contact between the heat transfer member and the core enhances heat dissipation, effectively reducing the core's temperature and thermal losses, thereby preventing or reducing temperature rise.
Implementation Method 1
The heat generated in the core during the operation of the circuit device and the power converter can be dissipated with a lower heat resistance to the first heat transfer member being in surface contact with the core
Data Source
AI summary
A circuit device and a power converter include a core, a coil surrounding at least a part of the core, and a first heat transfer member being in surface contact with the core. A temperature rise of the core can thus be prevented or reduced.