Core-Device Thermal Sensor Layout for Chip Hotspot Sensing
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Solution Overview
Problem
Conventional thermal sensors within chips have a large area and high voltage requirements, making them unsuitable for placement near critical hotspots, which affects temperature measurement accuracy and system performance.
Innovation Solution
Implementing thermal sensors using core devices within logic cells, allowing them to be positioned near hotspots without dummy regions, thus reducing sensor area and maintaining system performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal sensor is implemented using I/O devices with higher voltage endurance, then the sensor can operate at higher voltages, but the sensor cannot be manufactured in area adjacent to core devices and the temperature measurement does not reflect the real temperature
Solution Approach 1:
The patent changes the voltage parameter from high voltage (I/O device) to low voltage (core device) to enable the thermal sensor to be manufactured using the same process as logic cells, allowing placement adjacent to core devices for accurate temperature measurement
2Measurement precision
If thermal sensor is placed near the hottest region of the chip, then the temperature measurement accuracy is improved, but the thermal sensor with large chip area impacts system performance
Solution Approach 1:
The patent segments the thermal sensor into a compact design that fits within the logic cell structure, allowing it to be placed near hotspots without occupying excessive chip area that would impact system performance
Solution Approach 2:
The patent merges the thermal sensor with the logic cell structure, integrating the sensor within the same cell framework to minimize area occupation and avoid performance degradation
3Ease of manufacture
If thermal sensor with large chip area is used, then the sensor can be manufactured with standard processes, but the sensor cannot be placed near the hottest region without impacting system performance
Solution Approach 1:
The patent changes the manufacturing parameter by using core device processes instead of I/O device processes, enabling thermal sensor fabrication with standard logic cell processes and achieving compact area suitable for hotspot placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature measurement at chip hotspots with minimal impact on system performance by integrating thermal sensors as core devices within logic cells, reducing sensor area and voltage mismatch issues.
Implementation Method 1
the thermal sensor is positioned within the logic cells and surrounded by the logic cells, and the logic cells and the thermal sensor are all implemented by core devices
Data Source
AI summary
The present invention provides a processing circuit including logic cells and a thermal sensor. The thermal sensor is positioned within the logic cells and surrounded by the logic cells, and the logic cells and the thermal sensor are all implemented by core devices.