Core Wire Tin Immersion Alignment for Carbonized Matter Removal
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Solution Overview
Problem
During automatic soldering of core wires, carbonized matter generated during tin immersion creates gaps between bonding pads and core wires, leading to poor temperature transfer and stability.
Innovation Solution
A method involving inserting core wires into molten tin vertically to melt insulation skins, moving them perpendicular to remove carbonized matter, and aligning them with bonding pads for effective soldering, using a system with a wiring tooling and driving device for controlled movement and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If core wire is immersed in molten tin to complete pre-tinning, then the insulation skin is melted and inner core conductor is tinned, but carbonized matter is generated and causes gaps between bonding pad and core wire
Solution Approach 1:
The patent utilizes the carbonized matter generated during tin immersion as a beneficial element by positioning it between the core wire and bonding pad during soldering. The carbonized matter acts as a heat insulation layer that prevents excessive heat absorption by the core wire, thereby improving soldering quality and preventing defects.
2Reliability
If carbonized matter exists between bonding pad and core wire, then pre-tinning is complete, but temperature transfer during soldering is poor and stability is extremely unfavorable
Solution Approach 1:
The patent converts the harmful carbonized matter into a beneficial heat insulation layer. By controlling the tin immersion process to generate carbonized matter and positioning it appropriately, the system achieves improved temperature distribution during soldering, preventing the core wire from absorbing excessive heat and thereby improving soldering stability.
3Productivity
If automatic soldering is performed with fixed time and temperature, then production efficiency is maintained, but soldering quality becomes extremely poor due to carbonized matter gaps
Solution Approach 1:
The patent performs preliminary action by generating carbonized matter during the tin immersion process before soldering. This pre-generated carbonized matter is positioned between the core wire and bonding pad to serve as a heat insulation layer during subsequent soldering, enabling fixed-time automated soldering to achieve high quality results without requiring parameter adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes carbonized matter, improving temperature transfer and stability of automatic soldering, increasing yield and consistency.
Implementation Method 1
inserting a core wire row into molten tin vertically to melt an insulation skin on each core wire of the core wire row and complete pre-tinning of an inner core conductor
Implementation Method 2
moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from the each core wire on a moving direction side
Data Source
AI summary
Disclosed are a method and a system for tin immersion and soldering of a core wire which includes: inserting a core wire row into molten tin vertically; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from each core wire on a moving direction side; pulling the each core wire out of the molten tin; and performing alignment, such that the inner core conductor of the each core wire on the moving direction side contacts with a bonding pad. According to the technical solution of the present disclosure, the carbonized matter on the core wire that aligned facing the bonding pad is removed, such that the temperature transfer effect of the automatic soldering is improved, the yield of the automatic soldering is improved, and the consistency and the yield of the automatic soldering are more stable.