Cored Substrate Thermal Management via Fluid Channels

Solution Overview

Problem

Integrated circuit packages face thermal management challenges due to high temperatures, which can cause damage to organic substrate materials and integrated circuits, and existing solutions like ceramic materials are costly or inefficient.

Innovation Solution

Incorporating heat transfer fluid channels within the substrate core to facilitate heat dissipation, with build-up layers and methods such as etching or metal layer formation to create channels for efficient heat removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If organic materials are used to form the substrate, then cost is reduced and packaging density is increased, but thermal damage occurs at temperatures above 300 degrees Celsius or extended periods at 200-250 degrees Celsius

Engineering Contradiction:

Improvesubstrate material costVSAvoidsubstrate thermal resistance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

Heat transfer fluid channels are introduced as an intermediary cooling mechanism between the heat-generating integrated circuit devices and the substrate materials. The fluid channels carry heat transfer fluid that absorbs and removes heat, protecting the organic substrate materials from thermal damage while maintaining cost-effectiveness

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs hydraulic cooling by circulating heat transfer fluid through channels formed in the substrate core. This hydraulic system efficiently removes heat from high-power integrated circuit devices, enabling the use of lower-cost organic materials without suffering from thermal degradation

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Reliability

If ceramic materials are used to form the substrate, then thermal resistance is improved and higher temperatures are supported, but cost increases significantly and packaging density decreases

Engineering Contradiction:

Improvesubstrate thermal resistanceVSAvoidsubstrate material cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent employs hydraulic cooling by circulating heat transfer fluid through channels formed in the substrate core. This hydraulic system efficiently removes heat from high-power integrated circuit devices, enabling the use of lower-cost organic materials without suffering from thermal degradation

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The substrate is constructed as a composite structure combining organic materials with integrated heat transfer fluid channels. This composite approach allows the organic substrate to benefit from active cooling, achieving thermal performance comparable to ceramic materials while maintaining the cost and density advantages of organic materials

Inventive Principle:

Principle #40Composite materials

3Loss of energy

If metal layers are used within the substrate for heat dissipation, then some heat removal is achieved, but efficiency is insufficient due to the thinness of the metal layers

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidheat removal efficiency

Core Design Contradiction:

Loss of energyVSProductivity

Solution Approach 1:

The patent employs hydraulic cooling by circulating heat transfer fluid through channels formed in the substrate core. This hydraulic system efficiently removes heat from high-power integrated circuit devices, enabling the use of lower-cost organic materials without suffering from thermal degradation

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The patent transitions from two-dimensional heat dissipation through thin metal layers to three-dimensional heat removal through fluid channels extending through the substrate core. This dimensional change enables significantly higher heat transfer efficiency by providing direct thermal coupling between the heat-generating devices and the cooling fluid

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly reduces thermal damage to substrate components and integrated circuit devices by effectively dissipating heat, improving reliability and performance without the need for expensive ceramic materials or significant performance reduction.

Implementation Method 1

Incorporating heat transfer fluid channels within the substrate core to facilitate heat dissipation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

heat transfer fluid channels within the substrate core to facilitate heat dissipation

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11640929B2Thermal management solutions for cored substrates

Publication Date: 2023.05.02 INTEL CORP

AI summary

An integrated circuit assembly may be formed having a substrate core, wherein the substrate core includes at least one heat transfer fluid channel formed therein, a first build-up layer formed on a first surface of the substrate core, and a second build-up layer formed on a second surface of the substrate core, and methods of fabricating the same. In embodiments of the present description, the integrated circuit structure may include at least one integrated circuit device formed within at least one of the first build-up layer and the second build-up layer. The embodiments of the present description allow for cooling within the substrate, which may significantly reduce thermal damage to the components of the substrate and/or integrated circuit devices within the substrate.