Coreless Connector via Cantilever Structure and Conductive Via
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Solution Overview
Problem
Conventional methods for manufacturing connectors are complex and unable to meet miniaturization requirements due to their thickness, particularly in 3C electronic devices, as they involve a via holes electroplating process and include core layers that contribute to the connector's thickness.
Innovation Solution
A manufacturing method that forms a connector without core layers by providing a substrate layer, patterning a metal layer to create a wiring layer, forming a dielectric layer with via holes, and integrating a conductive structure on the inner via hole walls, followed by a cantilever structure connected to the wiring layer, eliminating the need for via hole plating and simplifying the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a core layer with conductive vias is used in conventional connector manufacturing, then electrical connectivity is achieved, but the connector thickness increases and the process becomes complex due to via hole electroplating
Solution Approach 1:
The patent extracts and removes the core layer from the connector structure, replacing it with a substrate layer that has embedded conductive patterns. This eliminates the need for via hole electroplating processes while maintaining electrical connectivity, thereby reducing both thickness and manufacturing complexity
Solution Approach 2:
Instead of forming conductive vias through electroplating in the conventional manner, the patent inverts the approach by pre-forming conductive patterns on the substrate layer before assembling the connector components. This reversal of the manufacturing sequence simplifies the overall process and reduces thickness
2Reliability
If via hole electroplating process is used to form conductive vias, then electrical connectivity is achieved, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent performs preliminary action by pre-forming the conductive patterns on the substrate layer before the main assembly process. The conductive patterns are created in advance using screen printing or other deposition methods, eliminating the need for time-consuming electroplating operations during connector manufacturing
Solution Approach 2:
The patent replaces the electrochemical electroplating system with mechanical or chemical deposition methods such as screen printing, inkjet printing, or paste deposition. This substitution maintains electrical connectivity while significantly improving manufacturing efficiency and reducing process complexity
Data Source
AI summary
The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one cantilever structure. The dielectric layer is disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer. The conductive structure is disposed on the inner wall of the at least one via hole of the dielectric layer and electrically connected to the wiring layer. The first protective layer is disposed on the dielectric layer. The cantilever structure is disposed between the first protective layer and the dielectric layer, wherein the at least one cantilever structure is electrically connected to the wiring layer via the conductive structure.