Coreless Cavity Substrates for High-Density Chip Packaging

The patent replaces mechanical drilling and laser ablation with an electrochemical etching process. A copper base is etched using electrochemical methods to form vias and cavities, eliminating the need for mechanical or thermal systems. This substitution enables parallel processing of multiple vias simultaneously, dramatically increasing production speed while reducing manufacturing costs through a simpler, more scalable process.

The patent merges multiple via formation operations into a single parallel electrochemical etching process. All vias and cavities are formed simultaneously through one etching step rather than sequentially drilling and filling each via individually. This merging of operations maintains precise via formation through controlled electrochemical parameters while dramatically increasing production throughput by processing all features in parallel.

The patent transitions from planar interconnections to three-dimensional vertical interconnections by forming cavities and stacked structures. Multiple chip layers are interconnected through vertical vias and cavities etched through the substrate, enabling compact multi-layer packaging. This dimensional change allows complex interconnections to be achieved with simpler, more direct vertical pathways rather than complex lateral routing, reducing overall package height and interconnection complexity.

The patent replaces the multi-step mechanical and chemical process of drilling, plating, and filling vias with a single electrochemical etching process. The copper base is etched to form vias and cavities in one operation, eliminating the need for sequential drilling, plating, and filling steps. This substitution maintains reliable electrical connectivity through precise electrochemical control while dramatically improving production efficiency and reducing manufacturing costs.