Coreless Embedded Ball Land Substrate for Semiconductor Packages
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The development of an embedded ball land substrate with a coreless design, featuring a mold layer that encapsulates ball lands on the bottom surface and contact pads on the top surface, which reduces warpage and enhances structural integrity, along with a method of fabricating semiconductor devices using this substrate by attaching a semiconductor die and forming an encapsulant over it.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing processes are established, but cost is high, reliability is decreased, and package size is large
Solution Approach 1:
The patent extracts the substrate core from the package structure, creating a coreless substrate design. This removal of the traditional substrate core enables direct attachment of the semiconductor die to the substrate, eliminating unnecessary structural elements and reducing manufacturing complexity while improving reliability through fewer potential failure points
Solution Approach 2:
The patent implements nesting by embedding the ball lands directly within the substrate structure and encapsulating them with mold compound. The semiconductor die is then attached directly to the substrate, with the encapsulant surrounding both the die and embedded ball lands, creating a compact nested arrangement that reduces package size and improves reliability
2Productivity
If conventional semiconductor packages are used, then structural support is provided, but package size is large and performance is low
Solution Approach 1:
By removing the substrate core and using a coreless substrate design, the patent eliminates unnecessary volume while maintaining structural support through the substrate material itself and the encapsulant, thereby improving performance through reduced signal paths and lower inductance without increasing package size
Solution Approach 2:
The patent transitions from a traditional layered structure to a more integrated three-dimensional arrangement where ball lands are embedded within the substrate and the encapsulant provides vertical support, enabling compact packaging that improves performance by reducing overall package dimensions while maintaining structural integrity
3Stability of the object's composition
If mold layer encapsulates ball lands, then structural integrity is enhanced and warpage is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the mold layer formation with the substrate manufacturing process, creating an integrated structure where the mold compound encapsulates the ball lands as part of the substrate fabrication. This consolidation of steps enhances structural integrity by ensuring proper integration of the mold layer with the substrate while actually reducing overall manufacturing complexity through process integration
Data Source
AI summary
A electronic device includes an embedded ball land substrate and a semiconductor die. The embedded ball land substrate includes a top surface, a bottom surface opposite the top surface, and one or more side surfaces adjacent the top surface and the bottom surface. The embedded ball land substrate further includes a mold layer on the bottom surface, contact pads on the top surface, and ball lands embedded in the mold layer and electrically connected to the contact pads. The semiconductor die includes a first surface, a second surface opposite the first surface, one or more side surfaces adjacent the first surface and the second surface, and attachment structures along the second surface. The semiconductor die is operatively coupled to the contact pads via the attachment structures.