Coreless Electronic Package Ground Layer Patterning for Warpage Control
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Solution Overview
Problem
Conventional package on package (PoP) devices face issues with warpage due to differences in structure and material properties between substrates, and are limited in reducing overall package height due to the use of substrates with core layers.
Innovation Solution
The electronic package incorporates a cladding layer with fan-out redistribution layers and conductive pillars, along with a ground layer featuring sheet bodies, holes, and slots to improve flexibility and reduce warpage, allowing for a coreless design that minimizes package height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional substrates with core layers are used, then structural stability is maintained, but package height cannot be reduced
Solution Approach 1:
The patent removes the core layer from the substrate structure, transitioning from a conventional core-based substrate to a coreless substrate. This extraction of the core layer directly enables height reduction while the remaining layers (cladding layers, circuit structures, ground layers) provide the necessary structural support and functionality.
Solution Approach 2:
The substrate is divided into multiple functional layers including first and second cladding layers, circuit structures, and ground layers with specific patterns. This segmentation allows each layer to perform its specific function while collectively providing structural stability without requiring a bulky core layer.
2Reliability
If conventional substrates are used, then manufacturing process is straightforward, but warpage occurs due to material property differences
Solution Approach 1:
The ground layers are designed with specific patterns (sheets, grids, or meander shapes) and positioned at specific locations within the substrate structure. This local optimization of ground layer distribution provides targeted warpage control in regions where material property differences cause the most significant stress, while maintaining overall manufacturing feasibility.
Solution Approach 2:
The substrate employs composite construction with multiple cladding layers, circuit structures, and ground layers made of different materials. This composite structure allows for balanced material properties that compensate for warpage-causing differences, achieving better dimensional stability while remaining manufacturable.
3Reliability
If ground layers with continuous sheets are used, then electrical connectivity is improved, but flexibility and warpage control are reduced
Solution Approach 1:
The ground layers are segmented into discrete patterns such as sheets, grids, or meander shapes rather than using continuous solid sheets. This segmentation maintains electrical connectivity through the distributed pattern while introducing structural flexibility that helps accommodate warpage and reduces overall substrate rigidity, improving manufacturability.
Data Source
AI summary
An electronic package is provided, and the manufacturing method of which is to form a plurality of conductive pillars and dispose an electronic element on a first circuit structure, then cover the plurality of conductive pillars and the electronic element with a cladding layer, and then form a second circuit structure on the cladding layer, so that the plurality of conductive pillars are electrically connected to the first circuit structure and the second circuit structure, and the electronic element is electrically connected to the first circuit structure, where a fan-out redistribution layer is configured in the first circuit structure and the second circuit structure, and at least one ground layer is configured in the second circuit structure. Further, the ground layer includes a plurality of sheet bodies arranged in an array, so that at least one slot is disposed between every two adjacent sheet bodies.