Coreless Package Carrier Design for Thin Electronic Packaging
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Solution Overview
Problem
Conventional electronic packages include a core layer that adds thickness, making them less suitable for thinning trends in mobile devices, and existing manufacturing methods are complex and inefficient in producing package carriers without a core layer.
Innovation Solution
A package carrier is designed without a core layer, featuring a wiring layer with connecting and mounting pads, and an insulating pattern stacked on the wiring layer, where the insulating pattern is detachably fixed to a supporting board, allowing for the fabrication of thinner electronic packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a core layer is included in the package carrier structure, then the structural stability and electrical insulation are improved, but the overall thickness of the electronic package increases
Solution Approach 1:
The patent removes the core layer from the package carrier structure, extracting only the essential functional elements (wiring layer with pads and insulating pattern) needed for electrical connectivity and insulation. This extraction eliminates the thickness contribution of the core layer while maintaining the necessary structural and electrical functions through the simplified wiring-layer-based design.
Solution Approach 2:
The patent segments the package carrier into distinct functional layers: a wiring layer containing conductive traces and pads, and an insulating pattern layer. This segmentation allows each layer to perform its specific function independently, eliminating the need for a separate core layer while maintaining structural stability and electrical insulation through the coordinated design of these segmented layers.
2Ease of manufacture
If a core layer is included in the package carrier, then electrical insulation between wiring layers is ensured, but the manufacturing complexity increases
Solution Approach 1:
The patent extracts the core layer from the traditional multi-layer package carrier structure, simplifying the manufacturing process by reducing the number of layers that need to be fabricated and assembled. The essential electrical insulation function is maintained through the insulating pattern layer, eliminating the need for complex core layer processing while preserving the necessary electrical isolation between conductive elements.
Solution Approach 2:
The patent merges the electrical insulation function previously performed by the core layer into the insulating pattern layer that is already part of the wiring layer structure. This merging consolidates the package carrier into fewer integrated layers, reducing manufacturing complexity while maintaining the electrical insulation necessary for proper circuit operation.
3Adaptability or versatility
If conventional package carrier structure with core layer is used, then structural support is provided, but the adaptability to thin form factors is reduced
Solution Approach 1:
The patent extracts the core layer from the package carrier structure, directly reducing the overall thickness of the electronic package. This extraction enables the package to adapt to thinner form factors while maintaining structural support and electrical functionality through the optimized wiring layer and insulating pattern design.
Data Source
AI summary
A package carrier is provided. The package carrier includes a wiring layer and an insulating pattern. The wiring layer includes at least one connecting pad and at least one mounting pad. The mounting pad is used for mounting an electronic component, and the connecting pad is used for electrically connecting the electronic component. The insulating pattern is stacked on and connected to the wiring layer. A boundary surface is formed between the wiring layer and the insulating pattern. Both of the wiring layer and the insulating pattern do not extend over the boundary surface. In addition, an electronic package including the package carrier is also provided.