Coreless Semiconductor Packaging With Pressure-Assisted Sheet Peeling
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Solution Overview
Problem
The existing methods for producing semiconductor packages using the coreless buildup method face challenges with the curvature of thin buildup layers, leading to disconnection and peeling-off of wiring layers, which affects connection reliability and requires improvement in dissolving or softening the tacky layer for efficient peeling-off of reinforcing sheets without damaging the device or resin.
Innovation Solution
A method involving a tacky sheet with a soluble tacky layer in an intermittent pattern is used, where a pressure difference is applied to selectively immerse the lower end surface of the laminate in a dissolving solution to quickly dissolve or soften the tacky layer, allowing it to penetrate and facilitate the peeling-off of the reinforcing sheet without damaging the device or resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the thickness of the buildup layer is reduced to meet high integration and size reduction requirements, then the weight and size of the semiconductor package are reduced, but the buildup layer curves locally and largely when peeled off, causing disconnection and peeling-off of the wiring layer
Solution Approach 1:
The patent applies local quality by providing reinforcing sheets at specific locations where curvature is likely to occur during peeling, rather than uniformly throughout the entire buildup layer. The reinforcing sheets are strategically positioned to provide localized support to the thin buildup layer, preventing disconnection and peeling-off of the wiring layer while maintaining overall weight reduction.
Solution Approach 2:
The patent uses composite materials by combining the thin buildup layer with reinforcing sheets having different mechanical properties. The reinforcing sheets are made of materials with higher stiffness and strength to compensate for the low mechanical properties of the thin buildup layer, creating a composite structure that maintains both weight reduction and connection reliability.
2Ease of operation
If a soluble tacky layer is used to facilitate peeling-off of the reinforcing sheet, then the ease of operation is improved, but it takes a long time for the dissolving solution to penetrate and dissolve the tacky layer
Solution Approach 1:
The patent applies porous materials by providing a porous layer between the buildup layer and the reinforcing sheet. This porous layer acts as a channel network that allows the dissolving solution to rapidly penetrate from the outer surface to the soluble tacky layer, significantly reducing the dissolution time while maintaining ease of operation for peeling off the reinforcing sheet.
Solution Approach 2:
The porous layer serves as an intermediary structure that mediates between the dissolving solution and the soluble tacky layer. It facilitates rapid transport of the dissolving solution to the tacky layer through capillary action and provides a large surface area for dissolution, thereby reducing the overall time required while maintaining operational ease.
3Ease of operation
If the soluble tacky layer is dissolved or softened by immersing the laminate in dissolving solution, then the ease of operation is improved, but the device and resin-sealing material may be damaged by contact with the dissolving solution
Solution Approach 1:
The patent applies segmentation by dividing the dissolution process into two stages: first, the porous layer is dissolved to create channels; second, the dissolving solution penetrates through these channels to dissolve the soluble tacky layer. This segmented approach allows the dissolving solution to reach the tacky layer without prolonged exposure to the device and resin-sealing material, minimizing damage while maintaining ease of operation.
Solution Approach 2:
The patent implements skipping by rapidly transporting the dissolving solution through the porous layer channels to reach and dissolve the soluble tacky layer quickly, minimizing the exposure time of the device and resin-sealing material to the dissolving solution. This rushed-through approach reduces harmful effects while maintaining operational ease.
4Manufacturing precision
If a reinforcing sheet is laminated on the multilayer laminate to improve handleability, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The patent applies taking out by making the reinforcing sheet removable after it has served its purpose during manufacturing. The soluble tacky layer and porous layer are designed to be dissolved away, allowing the reinforcing sheet to be peeled off easily after the buildup layer has been formed and cured. This extracts the temporary support function after it is no longer needed, reducing final device complexity while maintaining manufacturing precision.
Solution Approach 2:
The patent implements discarding and recovering by designing the porous layer and soluble tacky layer as temporary, disposable components that are dissolved and removed after serving their reinforcing function during manufacturing. This allows the reinforcing sheet to provide necessary support during production, then be discarded along with the dissolvable layers, leaving no permanent additional structure in the final device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses damage to the device and resin, improves the connection reliability of the wiring layer, and enables efficient peeling-off of the reinforcing sheet, enhancing the overall production process of semiconductor packages.
Implementation Method 1
giving a pressure difference between an internal space, which is between the second support substrate and the redistribution layer of the fourth laminate, and the solution to allow the solution to penetrate into the internal space by the pressure difference
Implementation Method 2
dissolving or softening the soluble tacky layer
Data Source
AI summary
A method for producing a semiconductor package, capable of suppressing damage of a device, and dissolving or softening a tacky layer quickly to peel off a reinforcing sheet, is provided. This method includes: providing a tacky sheet including a soluble tacky layer, making a first laminate, obtaining a second laminate having a second support substrate bonded to the first laminate, peeling off a first support substrate to obtain a third laminate, mounting a semiconductor chip thereon to obtain a fourth laminate, sealing a right end surface and a left end surface of the fourth laminate with sealing members and immersing a lower end surface of the fourth laminate selectively in a solution, giving a pressure difference between an inner space and the solution to allow the solution to penetrate into the internal space and dissolve or soften the soluble tacky layer, and peeling off the second support substrate.