Coreless Leadframe Packaging with Pre-molded Recess
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Solution Overview
Problem
Conventional integrated circuit packaging systems face challenges with high costs, long cycle times, and complex process controls due to the use of costly materials like core and pre-preg in leadframe manufacturing, particularly as electronic components shrink in size and consumer expectations increase.
Innovation Solution
The method involves using a conductive material to form I/O pillars with exposed pads and a bottom recess, followed by forming pre-molded material in the recess and creating lead islands, which are then connected and encapsulated, employing low-cost, coreless, single metal layer subtractive processes to reduce material costs and simplify manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional materials like core and pre-preg are used for leadframe manufacturing, then the structural integrity and reliability are maintained, but the manufacturing cost increases and cycle time lengthens
Solution Approach 1:
The patent extracts and eliminates the pre-preg material layer from the traditional leadframe structure, retaining only the essential metal core. This extraction removes unnecessary manufacturing steps (laminating, curing pre-preg) while maintaining the structural integrity needed for leadframe functionality, thereby reducing cycle time and cost without compromising reliability
Solution Approach 2:
The patent applies preliminary plating and etching processes directly to the metal core before final assembly. By pre-forming the conductive patterns and structural features on the metal core itself, the invention eliminates subsequent laminating and curing steps that would extend cycle time, while ensuring the structural integrity is established early in the process
2Stability of the object's composition
If conventional core and pre-preg materials are used for leadframe manufacturing, then the structural stability is maintained, but the material cost increases
Solution Approach 1:
The patent replaces expensive pre-preg materials with a simpler metal core structure that is plated and etched directly. The metal core serves as both the structural substrate and the conductive element, eliminating the need for costly pre-preg materials while maintaining sufficient structural stability for the application
Solution Approach 2:
The patent creates a composite structure by combining the metal core with plated layers (such as copper or other conductive materials) directly on the core surface. This composite approach provides the necessary structural stability and electrical conductivity without requiring separate pre-preg layers, thereby reducing material costs while maintaining performance
3Manufacturing precision
If conventional leadframe manufacturing processes are used, then the process control requirements are met, but the manufacturing complexity increases
Solution Approach 1:
The patent segments the manufacturing process into distinct modular steps: metal core preparation, plating, etching, and assembly. Each segment can be independently controlled and optimized, reducing overall process complexity while maintaining precision through focused control at each stage rather than managing a monolithic complex process
Data Source
AI summary
An integrated circuit packaging system, and method of manufacture thereof, includes: lead islands; a pre-molded material surrounding a bottom of the lead islands; a device over a portion of the lead islands and having electrical connections to another portion of the lead islands, the electrical connections over areas of the another portion of the lead islands over areas covered by the pre-molded material; and an encapsulation over the device and the lead islands.