Coreless Semiconductor Package Fabrication Using Dual Carrier Support

Solution Overview

Problem

Conventional coreless semiconductor packaging substrates lack rigidity, leading to warpage and delamination issues during chip bonding and encapsulation, which reduces product yield and reliability, and increases material costs due to discarded substrates.

Innovation Solution

A semiconductor package fabrication method involving a packaging substrate with an insulating protection layer and a circuit layer composed of multiple sub-layers, using two carriers to provide support and prevent warpage, with the first carrier acting as a support during substrate formation and the second carrier ensuring rigidity during subsequent processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a coreless packaging substrate is used to reduce thickness, then the package size is reduced, but the substrate rigidity decreases leading to cracking and warpage

Engineering Contradiction:

Improvepackage sizeVSAvoidsubstrate rigidity

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent applies preliminary action by forming a rigid support structure (comprising a first rigid support layer and a second rigid support layer) at the back surface of the packaging substrate before the substrate is thinned. This preliminary reinforcement prevents warpage and cracking during subsequent processing steps while allowing the front surface to be thinned to achieve miniaturization. The support structure is prepared in advance to counteract the rigidity loss that would occur after thinning.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs composite materials by combining the thin packaging substrate with a rigid support structure made of different material layers (first rigid support layer and second rigid support layer). This composite construction allows the substrate to be thin and flexible for miniaturization while the composite back surface provides the necessary rigidity and dimensional stability to prevent warpage and cracking during processing.

Inventive Principle:

Principle #40Composite materials

2Volume of moving object

If the packaging substrate thickness is reduced for miniaturization, then the package size decreases, but the substrate becomes prone to warpage and delamination

Engineering Contradiction:

Improvepackage sizeVSAvoidsubstrate stability

Core Design Contradiction:

Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The patent applies preliminary action by forming a rigid support structure (comprising a first rigid support layer and a second rigid support layer) at the back surface of the packaging substrate before the substrate is thinned. This preliminary reinforcement prevents warpage and cracking during subsequent processing steps while allowing the front surface to be thinned to achieve miniaturization. The support structure is prepared in advance to counteract the rigidity loss that would occur after thinning.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent employs composite materials by combining the thin packaging substrate with a rigid support structure made of different material layers (first rigid support layer and second rigid support layer). This composite construction allows the substrate to be thin and flexible for miniaturization while the composite back surface provides the necessary rigidity and dimensional stability to prevent warpage and delamination during processing.

Inventive Principle:

Principle #40Composite materials

3Strength

If a core layer is added to improve substrate rigidity, then the substrate strength increases, but the package thickness increases

Engineering Contradiction:

Improvesubstrate rigidityVSAvoidpackage thickness

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The patent applies segmentation by dividing the support function into two separate rigid support layers (first rigid support layer and second rigid support layer) positioned at the back surface of the substrate, rather than using a single thick core layer. This segmented approach provides sufficient rigidity to prevent warpage and cracking while keeping the overall package thickness minimized, as the support layers are positioned at the back surface rather than increasing the front surface thickness.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies dimensionality change by moving the support function from the front surface (where it would increase package thickness) to the back surface of the substrate. The rigid support structure is formed at the back surface, providing dimensional stability and rigidity without increasing the overall package thickness measured from the front surface, thus resolving the contradiction between strength and thickness.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9112063B2Fabrication method of semiconductor package

Publication Date: 2015.08.18 SILICONWARE PRECISION IND CO LTD

AI summary

A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.