Coreless Sensor Device Using PCB Inductors for Powerline Detection
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Solution Overview
Problem
Conventional sensor devices with magnetic cores are costly and increase in size, while coreless designs without magnetic cores struggle to reduce costs and maintain sensitivity, especially when using Hall ICs in multilayer printed circuit boards.
Innovation Solution
A sensor device with overlapping power lines and semiconductor devices featuring inductors formed using interconnect layers, eliminating the need for magnetic cores and reducing manufacturing costs by integrating inductors within the semiconductor device, which increases sensitivity and detection capability without enlarging the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a magnetic core is provided in the power meter, then the sensitivity of the power line increases, but the sensor device increases in size and manufacturing costs rise
Solution Approach 1:
The patent extracts and eliminates the magnetic core component from the sensor device. Instead of using a traditional magnetic core structure, the invention employs a coreless design where the coil is formed directly on the printed circuit board using interconnect layers, removing the need for separate magnetic core components and their associated costs and complexity.
Solution Approach 2:
The patent merges the coil structure with the printed circuit board interconnect layers. The coil is formed using conductive patterns on the PCB substrate itself, combining functions that were previously separate (coil winding and circuit board structure) into a single integrated structure, thereby reducing component count and manufacturing complexity.
2Device complexity
If a coreless design without magnetic core is used, then device size and costs are reduced, but sensitivity and detection capability deteriorate
Solution Approach 1:
The patent changes key parameters of the coil structure to compensate for the absence of a magnetic core. This includes optimizing the number of windings (increasing to enhance magnetic coupling), adjusting the coil geometry and dimensions, and positioning the coil in close proximity to the power line trace on the PCB. These parameter adjustments maintain sufficient sensitivity while preserving the coreless design advantages.
Solution Approach 2:
The patent utilizes the third dimension (vertical stacking) by forming the coil on a PCB layer that is positioned close to the power line trace. This spatial arrangement in the vertical dimension enhances magnetic coupling between the power line and the sensing coil without requiring additional horizontal space or a magnetic core, thereby maintaining sensitivity in a compact form factor.
3Device complexity
If Hall IC is buried in multilayer printed circuit board, then coreless design is achieved, but manufacturing costs do not sufficiently reduce
Solution Approach 1:
The patent extracts and removes the Hall IC component from the design. Instead of using a Hall effect sensor that requires burial in the multilayer PCB, the invention employs a simple voltage divider circuit formed by resistors on the PCB, which is much simpler to manufacture and does not require embedding expensive IC components within the board structure.
Solution Approach 2:
The patent replaces the expensive Hall IC with inexpensive passive components (resistors) that can be easily manufactured using standard PCB fabrication processes. This substitution with cheaper components significantly reduces manufacturing costs while achieving the same functional goal of detecting current through voltage measurement across a known resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances sensitivity and reduces costs by eliminating the need for magnetic cores and coil patterns in printed circuit boards, allowing for more windings and improved signal intensity while maintaining device size and reducing noise interference.
Implementation Method 1
When the amount of current flowing through the power line changes, the intensity of a magnetic field generated from the power line also changes. Power according to a change in the intensity of the magnetic field is generated in the inductor.
Data Source
AI summary
A sensor device includes a power line and a semiconductor device. The semiconductor device includes an inductor. The inductor is formed using an interconnect layer (to be described later using FIG. 3). The power line and the semiconductor device overlap each other when viewed from a direction perpendicular to the semiconductor device. The semiconductor device includes two inductors. The power line extends between the two inductors when viewed from a direction perpendicular to the semiconductor device.