Coreless Package Substrate Bonding Without Carrier Boards
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Solution Overview
Problem
The high cost of using carrier boards in the production of coreless package substrates and the need for single-piece production methods limit the efficiency and cost-effectiveness of conventional manufacturing processes.
Innovation Solution
A method involving the adhesive bonding of two metal sheets to form a circuit base-material board, eliminating the need for carrier boards, and simultaneously processing these sheets to produce two package substrates with a single layer of circuits, utilizing etching and RCC lamination processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If carrier boards are used in the manufacturing of coreless package substrates, then the structural support and process stability are improved, but the production cost increases significantly
Solution Approach 1:
The invention extracts and eliminates the carrier board from the manufacturing process. By developing a direct bonding method between copper sheets and the package substrate, the patent removes the intermediate carrier board component entirely, thereby eliminating its associated cost while maintaining process stability through the direct bonding mechanism
Solution Approach 2:
The invention replaces the expensive carrier board with inexpensive copper sheets that serve as temporary substrates during manufacturing. These copper sheets are discarded after serving their purpose, effectively substituting a high-cost reusable component with low-cost single-use materials
2Ease of manufacture
If conventional single-piece production methods are used, then the manufacturing process simplicity is maintained, but the production capacity and efficiency are limited
Solution Approach 1:
The invention merges multiple production operations into a single integrated process. By bonding multiple copper sheets together with the package substrate simultaneously, the method enables parallel processing of multiple substrates in one batch, thereby increasing production capacity without significantly complicating the manufacturing process
Solution Approach 2:
The invention transitions from single-piece production to multi-piece production by utilizing the vertical stacking dimension. Multiple copper sheets are bonded in layers with the package substrate, effectively using the thickness dimension to enable simultaneous processing of multiple substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and significantly increases manufacturing capacity by eliminating carrier board expenses and enabling simultaneous production of two substrates, while maintaining structural integrity and electrical performance.
Implementation Method 1
uses an adhesive material to adhesively bond two metal sheets to each other to form a circuit base-material board
Implementation Method 2
mainly utilizes the bottom-up electroplating deposition method to create the copper column conductive structure between the layers of the carrier board
Data Source
AI summary
A method of manufacturing a package substrate, which mainly uses an adhesive material to bond two metal sheets to each other to form a circuit base-material board with sufficient rigidity. In addition to eliminating the need for a carrier board to save production costs, the method can also perform pattern development, etching, RCC lamination (Resin Coated Copper) and other manufacturing processes on both sides of the circuit base-material board simultaneously to produce a package substrate with a single layer of circuits, and can effectively and significantly improve the production efficiency and capacity of package substrate.