Coreless Substrate Assembly Using a Temporary Carrier Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing coreless semiconductor substrates lack mechanical rigidity, making them fragile and difficult to handle and assemble, especially when their dimensions exceed 50 mm, as they lack a core material for structural support.
Innovation Solution
The use of a carrier layer to support the manufacturing and assembly of coreless substrates, providing structural rigidity and enabling seamless processing, transportation, and assembly steps such as die flip, reflow, underfill, and heat sink attachment, before the carrier is removed for subsequent steps like solder ball attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If coreless substrates are made without core material to achieve high wireability and lower cost, then electrical performance and cost are improved, but mechanical rigidity deteriorates making them fragile and difficult to handle
Solution Approach 1:
A release film is introduced as an intermediary layer between the coreless substrate and the carrier during manufacturing. This release film allows the substrate to be handled and processed on the carrier while maintaining the coreless design's electrical performance and cost benefits. The release film is later removed to complete the substrate fabrication, resolving the mechanical fragility issue without compromising the coreless substrate's inherent advantages.
2Adaptability or versatility
If coreless substrates are made without core material to achieve high wireability, then electrical performance is improved, but mechanical rigidity deteriorates making them fragile and difficult to handle
Solution Approach 1:
The release film serves as a temporary mediator that enables the coreless substrate to be manufactured and handled with the mechanical support of a carrier. This allows the substrate to achieve high wireability and electrical performance characteristics of coreless design while temporarily gaining the mechanical rigidity needed for processing and assembly operations.
3Strength
If carrier layer is used to support coreless substrates during manufacturing, then mechanical strength is improved, but additional processing steps are required
Solution Approach 1:
The release film is selectively removed (extracted) from the substrate structure after the carrier has served its supporting function. This extraction step eliminates the temporary carrier and release film components, leaving only the final coreless substrate. While this adds a removal step, it enables the substrate to achieve its final form with the mechanical strength needed during manufacturing while maintaining the simplicity of the coreless design in the final product.
Data Source
AI summary
The present invention is directed to semiconductor devices and manufacturing methods. According to an embodiment, the present invention provides a semiconductor have includes a circuit that is coupled to a substrate. The substrate comprises a plurality of layers, some of which comprise organic material. In some implementations, the substrate may be a coreless substrate that is free from a core material. There are other embodiments as well.