Coreless Substrate Embedded Die Package Assembly

The patent applies preliminary action by pre-attaching the die to the substrate using wire-bonding interconnects before final package assembly. This eliminates the need for costly and complex flip-chip assembly processes later, as the die is already in place and electrically connected. The wire-bonding is performed in advance during substrate fabrication, simplifying subsequent assembly steps.

The patent extracts the die from the traditional flip-chip assembly process and embeds it directly into the substrate during substrate fabrication. This separation of the die attachment step from the final assembly process reduces both cost and complexity by using simpler wire-bonding technology instead of expensive flip-chip bonding equipment and processes.

The patent applies universality by designing the coreless substrate with a universal architecture that can accommodate multiple die types and stacking configurations. The substrate includes multiple die cavities and interconnect structures that support both wire-bonded and flip-chip mounted dies, as well as multiple stacking levels, all within a thin profile. This multi-functional design enables mixed-technology die stacking without requiring different substrate types.

The patent transitions from a conventional two-dimensional substrate layout to a three-dimensional stacked architecture. By embedding dies vertically within the substrate thickness and providing interconnects between multiple stacking levels, the design achieves high integration density in the vertical dimension while maintaining a thin overall packaging profile. This dimensional transition enables mixed-technology stacking capability.