Coreless Organic Substrate Corner Mounting Holes

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Solution Overview

Problem

Conventional organic substrates, especially larger ones, require a thick core layer for stiffness during assembly, leading to warpage issues that can cause interconnect failures and substrate cracks, making them prone to flexing and assembly yield reduction.

Innovation Solution

The formation of mounting holes near each corner of the substrate allows for secure assembly, enabling the use of thinner substrates, reducing warpage, and improving assembly yield by maintaining substrate rigidity during component and PCB assembly processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a thick core layer is used to maintain substrate stiffness, then substrate rigidity is improved, but substrate warpage increases and assembly yield decreases

Engineering Contradiction:

Improvesubstrate rigidityVSAvoidassembly yield

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The substrate is divided into multiple segments by forming through-holes near each corner that extend completely through the substrate thickness. These holes create discrete support points that segment the continuous substrate structure, allowing each segment to be independently supported and preventing overall warpage while maintaining local rigidity where needed.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Mounting pins are introduced as intermediary elements that fit into the through-holes of the substrate. These pins act as mediators between the substrate and the mounting surface, providing mechanical support and constraint that prevents flexing and warpage during assembly without requiring a thick core layer.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If a thick core layer is used to prevent substrate flexing, then substrate stability is improved, but package cost increases

Engineering Contradiction:

Improvesubstrate stabilityVSAvoidpackage cost

Core Design Contradiction:

Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The thick core layer is extracted or removed from the substrate structure. Instead of relying on increased thickness for stability, the invention uses through-holes and mounting pins to achieve the same stabilizing effect with a thinner, less expensive substrate material.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The substrate thickness parameter is reduced while maintaining stability through the introduction of through-holes and mounting pin support. This parameter change allows using thinner, cheaper materials while achieving the required mechanical stability through the hole-pin support mechanism.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If mounting holes are formed near each corner, then substrate warpage is reduced, but substrate complexity increases

Engineering Contradiction:

Improvewarpage reductionVSAvoidsubstrate structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The substrate is segmented by forming through-holes near each corner, creating discrete supported regions. This segmentation approach reduces warpage by providing localized support points while adding minimal structural complexity compared to a uniformly thick core layer.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS9648728B1Coreless organic substrate

Publication Date: 2017.05.09 ALTERA CORP

AI summary

A coreless organic substrate in which a mounting hole is formed near each corner of the substrate and is used during assembly processes to secure the substrate so as to prevent flexing.