Coreless Wiring Board with Reinforced Insulating Layers

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor element built-in wiring boards face challenges in preventing warpage due to thermal expansion coefficient differences and achieving efficient heat dissipation and mountability, particularly in coreless substrate designs without a core substrate.

Innovation Solution

A semiconductor element built-in wiring board is designed with a coreless substrate that includes a base substrate with a semiconductor element embedded, surrounded by a first build-up layer with embedded conductor pads and a second build-up layer with exposed conductor pads, both featuring resin materials with reinforcing materials like glass cloth, which enhances structural strength and heat dissipation while preventing warpage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a coreless substrate design is used to reduce weight and simplify structure, then device complexity and weight are reduced, but warpage occurs due to thermal expansion coefficient differences

Engineering Contradiction:

Improvesubstrate structureVSAvoidwarpage

Core Design Contradiction:

Device complexityVSStability of the object's composition

Solution Approach 1:

The patent uses a composite material comprising a resin material and a reinforcing material (such as glass cloth) for the insulating layers in the build-up layers. This composite structure provides both the necessary electrical insulation and mechanical reinforcement to prevent warpage in the coreless substrate design, while maintaining the weight and complexity advantages of the coreless architecture.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If insulating layers without reinforcing materials are used to simplify manufacturing, then ease of manufacture is improved, but structural strength and heat dissipation are insufficient

Engineering Contradiction:

Improveinsulating layer fabricationVSAvoidstructural strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The insulating layers are constructed as composites of resin materials and reinforcing materials like glass cloth. The resin material provides ease of manufacturing and molding, while the reinforcing material embedded within enhances structural strength and heat dissipation capabilities, resolving the contradiction between manufacturing simplicity and structural performance.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If traditional epoxy resin insulating layers are used, then ease of manufacture is maintained, but heat dissipation efficiency is insufficient

Engineering Contradiction:

Improveinsulating layer fabricationVSAvoidheat dissipation

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent employs composite insulating layers made of resin materials combined with reinforcing materials such as glass cloth. The resin material maintains ease of manufacture, while the reinforcing material provides enhanced thermal conductivity for improved heat dissipation, effectively resolving the contradiction between manufacturing ease and thermal performance.

Inventive Principle:

Principle #40Composite materials

4Ease of operation

If build-up layers with embedded conductor pads are used to improve mountability, then ease of operation is improved, but manufacturing precision requirements increase

Engineering Contradiction:

ImprovemountabilityVSAvoidconductor pad embedding

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The composite insulating layers with reinforcing materials provide enhanced structural integrity and dimensional stability, which helps maintain manufacturing precision during the conductor pad embedding process. The reinforced structure reduces deformation and warpage, making it easier to achieve precise conductor pad placement while maintaining good mountability.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces warpage and improves heat dissipation and mountability by using reinforcing materials in the insulating layers, ensuring reliable electrical connections and structural integrity.

Implementation Method 1

preventing warpage due to thermal expansion coefficient differences

Methodology Applied

Scientific EffectThermal expansion coefficient matching: Thermal Expansion

Implementation Method 2

improves heat dissipation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS9793219B2Semiconductor element built-in wiring board and method for manufacturing the same

Publication Date: 2017.10.17 IBIDEN CO LTD

AI summary

A wiring board includes a base substrate, a semiconductor element embedded in the substrate and having active and non-active surfaces such that the semiconductor has a terminal on the active surface, a first build-up layer including an insulating layer and first conductor pads such that the first conductor pads have exposed surfaces exposed from a surface of the insulating layer on the opposite side with respect to the substrate, and a second build-up layer including an insulating layer and second conductor pads such that the second conductor pads have exposed surfaces exposed from a surface of the insulating layer on the opposite side with respect to the substrate. The insulating layer in the first build-up includes resin material and reinforcing material, the insulating layer in the second build-up includes resin material and reinforcing material, and the first conductor pads is embedded in the insulating layer in the first build-up.