Coreless Wiring Substrate Warping Reduction via Reinforced Insulation
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Solution Overview
Problem
Wiring substrates without a core substrate tend to warp due to reduced rigidity, which affects the reliability and thickness of semiconductor devices.
Innovation Solution
Incorporating a thermosetting insulative resin with reinforcement materials in the insulation layer and a high-density wiring structure with photosensitive resin layers, while maintaining a coreless design, to enhance rigidity and reduce warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a core substrate is removed to reduce thickness, then the wiring substrate becomes thinner, but the rigidity is lowered and warping occurs
Solution Approach 1:
The patent applies composite materials by combining a thermosetting resin matrix with reinforcement materials (glass fibers, metal particles, or ceramic particles) to create an insulation layer that provides both structural support and rigidity without requiring a core substrate. This composite structure enables the wiring substrate to maintain strength while being thin and free from warping.
2Strength
If reinforcement materials are added to the insulation layer, then the rigidity is enhanced and warping is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the reinforcement materials directly into the insulation layer during the lamination process, combining multiple functions (insulation, structural support, and warping prevention) into a single integrated layer. This approach simplifies the overall manufacturing process by eliminating the need for separate core substrate removal steps while maintaining rigidity.
3Length of stationary object
If a core substrate is removed to achieve coreless design, then the thickness is reduced, but the wiring substrate tends to warp
Solution Approach 1:
The patent uses composite materials with thermosetting resin and reinforcement materials to provide inherent warping resistance in the thin insulation layer, eliminating the need for a core substrate while maintaining dimensional stability and preventing warping.
Solution Approach 2:
The patent applies local quality by strategically selecting and distributing reinforcement materials within the insulation layer to provide targeted structural support and warping resistance in specific regions, enabling the thin substrate to maintain stability without uniform thickening.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces warping and allows for a thinner, more rigid wiring substrate and semiconductor device, maintaining high wiring density and mechanical integrity.
Implementation Method 1
a first insulation layer formed from a thermosetting insulative resin and including a reinforcement material
Implementation Method 2
at least one second insulation layer formed from an insulative resin of which main component is a photosensitive resin
Implementation Method 3
The upper surface of the first insulation layer and the upper end surface of the via wiring are polished surfaces
Data Source
AI summary
A wiring substrate includes a first wiring structure. The first wiring structure has a first insulation layer including a reinforcement material. A first wiring layer is embedded in the first insulation layer. A second wiring structure having a higher wiring density than the first wiring structure is formed on the first insulation layer. The second wiring structure includes at least one second insulation layer and two or more second wiring layers. A lower surface of the first wiring layer is flush with a lower surface of the first insulation layer. The reinforcement material is located toward the second wiring structure from a thickness-wise center of the first insulation layer and laid out at a thickness-wise center of a thickness from the lower surface of the first insulation layer to an upper surface of the uppermost second wiring layer in the second wiring structure.