Coreless Wiring Substrate Warpage Correction via Composite Structure
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Solution Overview
Problem
The challenge is to manufacture electronic component devices that are thinner and smaller in size while minimizing warpage caused by thermal stress, which affects the reliability of the devices and their mounting on boards.
Innovation Solution
The solution involves using a cored wiring substrate with a core layer and a coreless wiring substrate stacked through connection terminals, with a reinforcing layer on the coreless substrate to correct warpage, and filling sealing resin between them, allowing for the formation of a thinner and smaller device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a thin substrate is used to reduce device thickness and size, then the device dimensions are reduced, but warpage occurs due to thermal stress
Solution Approach 1:
The patent employs a composite substrate structure consisting of a coreless wiring substrate (thin, flexible layer) combined with a core wiring substrate (rigid support layer). This composite construction allows the overall device to achieve reduced thickness while the rigid core layer provides structural stability and prevents warpage caused by thermal stress during manufacturing processes.
2Length of moving object
If a thin substrate is used to reduce device thickness and size, then the device dimensions are reduced, but manufacturing reliability decreases
Solution Approach 1:
The composite substrate structure with a rigid core layer provides sufficient mechanical strength and dimensional stability during manufacturing processes, enabling reliable assembly and soldering operations. The thin coreless wiring substrate layer achieves the desired reduced thickness while the core layer ensures manufacturing reliability by preventing excessive flexibility and handling difficulties.
3Length of moving object
If a thin substrate is used to reduce device thickness and size, then the device dimensions are reduced, but mounting reliability decreases
Solution Approach 1:
The rigid core wiring substrate layer provides adequate mechanical strength and dimensional stability that enables reliable mounting of the electronic component device on mounting boards. The coreless wiring substrate layer contributes to the reduced overall thickness while the composite structure ensures that the device maintains sufficient rigidity for reliable mounting and connection during installation and operation.
4Length of moving object
If substrate thickness is reduced, then device size is reduced, but warpage correction becomes difficult
Solution Approach 1:
The composite substrate structure inherently provides warpage correction capability through the rigid core layer that resists thermal stress-induced deformation. This eliminates the need for additional reinforcing layers or complex post-manufacturing warpage correction processes, thereby maintaining ease of manufacture while achieving reduced device size and thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses warpage and enhances the reliability of the electronic component device, enabling reliable mounting on boards and reducing the size and thickness of the device.
Implementation Method 1
The lower wiring substrate mounted with the electronic component on an upper surface thereof easily warps convexly because of thermal stress that is generated due to a difference in thermal expansion coefficient between the electronic component and the lower wiring substrate
Implementation Method 2
The connection terminal connects the cored wiring substrate and the coreless wiring substrate
Implementation Method 3
The sealing resin is filled between the cored wiring substrate and the coreless wiring substrate
Data Source
AI summary
An electronic component device includes a first coreless wiring substrate, an electronic component mounted on the first coreless wiring substrate, a second coreless wiring substrate disposed above the first coreless wiring substrate and the electronic component such that the second coreless wiring substrate is spaced from the first coreless wiring substrate and the electronic component, a connection terminal that connects the first coreless wiring substrate and the second coreless wiring substrate, and a sealing resin filled between the first and second coreless wiring substrates. Each of the first and second coreless wiring substrates include an insulating layer, a wiring layer, and a reinforcing layer embedded in the insulating layer and provided in a region overlaying the electronic component.