Corner Wideband Antennas for Low-Latency Chiplet Links
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Solution Overview
Problem
Current wireless broadcasting communication between carriers in multi-carrier architectures, such as chiplets and PCBs, suffers from high latency and bandwidth limitations, especially when carriers are close to each other, leading to inefficiencies in data transfer and increased energy consumption.
Innovation Solution
Implementing extremely-wideband antennas with a bow-and-arrow shape, integrated into the corners of carriers, utilizing driven blind vias and reflector through vias to enable wireless communication, reducing latency and congestion by allowing efficient data transfer across adjacent carriers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If wireless broadcasting communication is used between carriers, then communication speed is improved, but latency increases and bandwidth is limited when carriers are close to each other
Solution Approach 1:
The patent replaces traditional wired mechanical interconnects with wireless electromagnetic field-based communication. By using evanescent wave coupling between adjacent chiplets, the system eliminates physical connection constraints while achieving low-latency communication through direct near-field coupling, thus substituting a mechanical system with an electromagnetic field-based system.
Solution Approach 2:
The patent introduces an intermediary electromagnetic field mechanism (evanescent waves) that enables direct coupling between adjacent chiplets without requiring physical wire connections. This intermediary field allows carriers to communicate wirelessly while maintaining low latency through strong near-field coupling, effectively mediating the communication between carriers that are close to each other.
2Productivity
If wireless broadcasting communication is used between carriers, then data transfer efficiency is improved, but energy consumption increases
Solution Approach 1:
The patent changes the operational parameters by utilizing evanescent wave coupling in the near-field regime rather than far-field radiation. This parameter change enables efficient energy transfer over short distances between adjacent chiplets, achieving high data transfer efficiency while minimizing energy loss through optimized near-field coupling parameters.
Solution Approach 2:
The patent applies local quality by optimizing the wireless communication mechanism specifically for near-field coupling between adjacent chiplets. By tailoring the evanescent wave coupling characteristics to the specific geometric and electromagnetic properties of closely-spaced carriers, the system achieves high efficiency data transfer with reduced energy consumption localized to the immediate vicinity of the chiplets.
3Area of stationary object
If carriers are positioned close to each other, then integration density is improved, but wireless broadcasting performance deteriorates
Solution Approach 1:
The patent replaces traditional far-field wireless broadcasting with near-field evanescent wave coupling, enabling carriers to be positioned extremely close together while maintaining reliable communication. This substitution allows the system to achieve high integration density by placing chiplets in immediate proximity without suffering from the performance deterioration that would occur with conventional wireless broadcasting methods.
Solution Approach 2:
The patent transitions from three-dimensional far-field radiation patterns to two-dimensional near-field coupling between adjacent surfaces. By utilizing the evanescent field region between closely-spaced chiplets, the system enables reliable communication in a dimensionally-constrained environment, allowing high integration density while maintaining broadcasting performance through surface-proximity coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces interconnect latency, bandwidth requirements, and energy consumption while enabling scalable 3D heterogeneous chiplet integration, improving data throughput and cache messaging across adjacent chiplets.
Implementation Method 1
an antenna (350) integrated into a corner of the chiplet and extending along a direction towards the adjacent chiplet... configured to wirelessly communicate with the adjacent chiplet
Data Source
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AI summary
A device may include a plurality of carriers, wherein each carrier includes a plurality of communication processors, each communication processor disposed over or in a respective carrier of the plurality of carriers and configured to provide a wireless broadcasting communication channel, and a plurality of antennas, each antenna disposed on or in a respective carrier and coupled to a respective communication processor, wherein each antenna extends into a corner of the respective carrier, and wherein the antennas of each pair of adjacent carriers are positioned at a distance from each other at less than about 1 wavelength corresponding to the lowest operating frequency.