Corner Interconnect Component for Compact RF Passive Filters
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Solution Overview
Problem
Current passive devices require large pad areas for interconnects, leading to inefficient use of board space and limited integration with active devices, as the reduction in interconnect area is not proportional to the size reduction of individual components.
Innovation Solution
A corner interconnect component with a body portion and conducting portions at opposite corners, configured for input and output structures, allowing for compact interconnection of small parts and reduced parasitics, enabling smaller footprint and improved integration with active devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If large pad areas are used for interconnects in passive devices, then reliable electrical connection is achieved, but board space utilization deteriorates
Solution Approach 1:
The patent transitions from traditional coplanar pad layouts to a three-dimensional vertical interconnect structure. The conductive posts extend vertically through the substrate, utilizing the Z-dimension to establish electrical connections. This dimensional transition allows pads to be positioned closer together in the planar direction while maintaining reliable electrical connectivity through the vertical path, thereby reducing board space requirements without compromising connection reliability.
Solution Approach 2:
The invention embeds conductive posts within the substrate structure, nesting the interconnect elements inside the board rather than placing them all on the surface. The posts are integrated into the substrate layers, with insulating material surrounding them, creating a nested configuration that saves surface area while maintaining electrical pathways.
2Area of stationary object
If pad size is reduced proportionally with device size, then board space is reduced, but interconnect reliability deteriorates
Solution Approach 1:
The patent compensates for reduced pad footprint by extending conductive pathways in the vertical dimension. Instead of relying on large surface area pads, the design uses tall conductive posts that traverse through the substrate, providing robust electrical connection through the Z-axis. This allows small footprint pads to maintain reliable connectivity via the vertical interconnect path.
Solution Approach 2:
The interconnect structure employs composite construction with conductive posts made of conductive material surrounded by insulating material within the substrate. This composite arrangement provides both mechanical support and electrical conductivity, enabling reliable interconnect through the vertical pathway while the insulating material prevents unwanted electrical coupling, thus maintaining reliability with reduced pad area.
3Ease of manufacture
If traditional interconnect structures are used, then manufacturing simplicity is maintained, but parasitic effects increase
Solution Approach 1:
By moving the interconnect path to the vertical dimension through conductive posts, the patent reduces the horizontal current path length. This dimensional change minimizes parasitic inductance and resistance that would otherwise accumulate along longer trace paths on the board surface, while the manufacturing process remains compatible with standard PCB fabrication techniques.
Solution Approach 2:
The conductive posts act as intermediary elements between surface-mounted devices and the board's internal routing. These vertical interconnectors provide a direct, low-parasitic pathway that mediates the electrical connection, eliminating the need for long surface traces that would introduce parasitic effects, while the overall manufacturing process remains straightforward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The corner interconnect component enables smaller footprint and improved integration with active devices, reducing interconnect area requirements and enhancing performance in RF applications by allowing for tighter packing and reduced parasitics.
Implementation Method 1
a conducting portion, the conducting portion being connected to the first corner of the body portion, the conducting portion further being connected to the second corner of the body portion
Data Source
AI summary
The present invention is directed to a corner interconnect component which is a passive filter component. The corner interconnect component includes a body portion having an input structure located at a first corner of the component for receiving an input. At a second corner of the component, diagonally opposite the first corner, the component further includes an output structure for providing an output. The corner interconnect component further includes a conducting portion which is connected to the first and second corners of the body structure. The corner interconnect component is configured such that a plurality of the corner interconnect components may be implemented in a corner-to-corner configuration in a filter structure.