Corner-Opening Ring Structure for Low-Warpage Semiconductor Packaging
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Solution Overview
Problem
Conventional package structures experience significant molding stress and warpage due to large molding volumes, leading to increased risks of molding cracks and delamination.
Innovation Solution
A modified ring structure design is implemented, featuring a larger distance between the inner surfaces of the ring structure and the semiconductor package at corner portions, accompanied by a stiffener ring to reduce molding stress and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional package structure with standard ring design is used, then the structure is simple and easy to manufacture, but significant molding stress and warpage occur leading to increased risks of molding cracks and delamination
Solution Approach 1:
The ring structure is segmented into multiple distinct components: an inner ring, an outer ring, and corner portions connecting them. This segmentation allows each component to be optimized independently for its specific function - the inner ring for supporting the semiconductor package, the outer ring for reducing warpage, and the corner portions for stress distribution - thereby improving reliability while maintaining manufacturing feasibility through modular design
Solution Approach 2:
The ring structure implements local quality by varying the geometry and material properties at different locations. The corner portions are specifically designed with different dimensions and reinforcement compared to the straight sections, creating localized stress distribution zones that address the specific problem of molding stress concentration at corners without requiring complex modifications throughout the entire structure
2Reliability
If the distance between the ring structure inner surfaces and semiconductor package is increased at corner portions, then molding stress and warpage are reduced, but the overall package size increases
Solution Approach 1:
The spacing between the ring structure and semiconductor package is segmented into different regions: a larger distance at corner portions and a controlled distance at straight sections. This selective spacing approach allows the package to benefit from stress reduction at critical corner areas while maintaining compact dimensions in non-critical areas, effectively balancing reliability improvement with space efficiency
Solution Approach 2:
The design applies local quality by providing enhanced spacing and reinforcement only where needed - specifically at the corner portions where molding stress concentrates - rather than uniformly increasing the distance throughout the entire package. This localized approach reduces molding stress at critical points while minimizing the overall increase in package footprint
Data Source
AI summary
A package structure includes a circuit substrate, a semiconductor package, a first ring structure and a second ring structure. The semiconductor package is disposed on and electrically connected to the circuit substrate. The first ring structure is attached to the circuit substrate and surrounding the semiconductor package, wherein the first ring structure includes a central opening and a plurality of corner openings extending out from corners of the central opening, the semiconductor package is located in the central opening, and the plurality of corner openings is surrounding corners of the semiconductor package.