Corner Reinforcement Structure for 3DIC Drop Test Reliability
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Solution Overview
Problem
Challenges exist in leveraging 3DIC technology due to difficulties in bonding semiconductor dies to package components, particularly in achieving reliable mechanical and electrical connections while accommodating miniaturization and integration density requirements.
Innovation Solution
A semiconductor structure is designed with a metallic member sandwiched between a substrate and a board, utilizing first and second solders for mechanical and electrical connections, and an isolation member to encapsulate the structure, along with conductive bumps for additional electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor dies are bonded to package components using conventional methods, then electrical connections are established, but mechanical reliability under drop test conditions deteriorates
Solution Approach 1:
The patent applies beforehand cushioning by introducing a corner reinforcement structure comprising a metallic member and solder material positioned at the corners of the substrate before drop test conditions occur. This reinforcement structure absorbs and distributes impact forces during drop tests, preventing catastrophic failure of the solder joints connecting the semiconductor die to the substrate. The metallic member acts as a shock absorber and stress distributor, cushioning the vulnerable bonding interfaces against mechanical shocks.
Solution Approach 2:
The patent employs composite materials by combining different materials with complementary properties: a metallic member (such as copper or aluminum) provides high strength and ductility, while the solder material (such as锡合金) provides bonding capability and flexibility. This composite corner reinforcement structure leverages the advantages of each material to simultaneously achieve strong mechanical attachment and reliable electrical connection, resolving the contradiction between mechanical strength and electrical connectivity.
2Quantity of substance
If minimum feature size is reduced to increase integration density, then more components can be integrated into a given area, but manufacturing precision requirements worsen
Solution Approach 1:
The patent applies local quality by concentrating the corner reinforcement structure specifically at the corner regions of the substrate where semiconductor dies are bonded. Rather than uniformly reinforcing the entire substrate, the metallic member and additional solder material are strategically positioned only at the corners, providing enhanced mechanical strength precisely where needed for drop test reliability while maintaining fine feature sizes in the central bonding regions for high integration density.
Solution Approach 2:
The patent segments the reinforcement function from the overall substrate structure by introducing a separate, distinct corner reinforcement structure. This segmentation allows the corner regions to be optimized for mechanical strength with larger metallic members and additional solder, while the central substrate areas can maintain minimal feature sizes for high-density die bonding, thus resolving the contradiction between reinforcement needs and integration density requirements.
3Strength
If corner reinforcement structure is added to improve drop test reliability, then mechanical strength improves, but device complexity increases
Solution Approach 1:
The patent applies preliminary action by forming the corner reinforcement structure as an integrated part of the substrate fabrication process before the semiconductor die bonding occurs. The metallic member is deposited or attached to the substrate corners, and the additional solder material is applied in the same manufacturing sequence, ensuring the reinforcement structure is already in place to support subsequent die attachment and to provide immediate mechanical strength enhancement without requiring complex post-processing steps.
Solution Approach 2:
The patent merges the corner reinforcement function with the existing substrate and solder joint structure. The metallic member is integrated into the substrate corner regions, and the additional solder material is combined with the existing solder joints connecting the semiconductor die to the substrate. This merging approach allows the corner reinforcement structure to work synergistically with the existing package architecture, enhancing mechanical strength without creating a completely separate complex subsystem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances drop test reliability and miniaturization capabilities of semiconductor structures by providing secure mechanical and electrical connections, facilitating efficient integration of multiple components.
Implementation Method 1
A corner reinforcement structure is disposed between a substrate and a board. The corner reinforcement structure includes a metallic member, a first solder, and a second solder.
Implementation Method 2
an isolation member including an encapsulating material is disposed over the board and surrounds the conductive bump and the substrate
Data Source
AI summary
A semiconductor structure includes a conductive bump disposed between a substrate and a board; an isolation member disposed over the board and surrounding the conductive bump and the substrate; a metallic member disposed between the isolation member and the conductive bump; and a solder disposed between the substrate and the board and configured to attach the metallic member to the substrate and the board. A method of manufacturing a semiconductor structure includes disposing a first solder on a first surface of a substrate; disposing a metallic member to the first surface of the substrate by the first solder; disposing a second solder on a board; and bonding the metallic member to the board by the second solder.